EP2SGX60DF780C3 vs EP2SGX60DF780C4 Vergleich

Detaillierter Direktvergleich von EP2SGX60DF780C3 von Intel und EP2SGX60DF780C4 von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.

Spezifikationsvergleich

Parameter EP2SGX60DF780C3 EP2SGX60DF780C4
Marke Intel Intel
Kategorie FPGA & CPLD FPGA & CPLD
Lebenszyklusstatus Obsolete NRND
Lagerstatus In Stock In Stock
Stückpreis (USD) $218,00 $1.350,00
Family Stratix II GX —
Series Stratix II —
Logic Elements / Cells 60,440 —
Logic Array Blocks (LABs) 3,022 —
Total RAM Bits [DATA_NEEDED: total embedded memory bits] —
Number of I/O 364 —
Number of Transceivers Up to 20 —
Transceiver Data Rate Up to 6.375 Gbps —
Core Voltage 1.2 V —
Process Technology 90 nm 90 nm CMOS
Internal Frequency (max) ~717 MHz —
Gehäuse 780-ball FC-FBGA (FineLine BGA), 29 x 29 mm, 1.0 mm pitch —
Montageart Surface Mount Surface Mount
Operating Temperature (TJ) 0 °C to +85 °C (commercial, C speed grade) —
Speed Grade C3 (fastest commercial) 4 (C4)
RoHS-Status Non-compliant (legacy Altera-era BGAs use SnPb or non-RoHS bump finish; verify per lot) Compliant
Device Family — Stratix II GX
Logic Elements — 60,440
Embedded Memory Bits — 2,544,192
User I/O Count — 364
Maximum Internal Frequency — 717 MHz
Transceiver Channels — [DATA_NEEDED: exact transceiver count and data rate]
Number of CLBs — 60,440
Core Supply Voltage — 1.2 V
Package Type — 780-ball FC-FBGA
Package Dimensions — 29 x 29 mm
Ball Pitch — 1.0 mm
Operating Temperature Grade — Commercial (C)

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