EP2SGX60DF780C5N - Stratix II GX FPGA, 60K LE, 780-FBGA | Altera
Teilenummer: EP2SGX60DF780C5N ✗ Abgekündigt| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $285 | $285,00 |
| 10 | $265 | $2.650,00 |
| 100 | $240 | $24.000,00 |
| 500 | $220 | $110.000,00 |
| 1.000 | $205 | $205.000,00 |
EP2SGX60DF780C5N Übersicht
A Field Programmable Gate Array (FPGA) is a reprogrammable semiconductor device whose logic fabric, routing, and I/O can be configured by the end designer after manufacture. The Stratix II GX family belongs to the broader hierarchy of programmable logic devices (PLD) -> FPGA -> high-performance transceiver-equipped FPGA -> embedded system-on-chip prototyping silicon. Compared with earlier Stratix generations, Stratix II GX introduced adaptive logic modules (ALMs) and embedded DSP blocks for high-throughput arithmetic, while the GX suffix indicates the addition of multi-gigabit transceivers that operate up to 6.375 Gbps.
Key features include 60,440 logic elements (LE), 3,022 LABs/CLBs, 2,544,192 bits of embedded RAM (≈2.5 Mb), embedded DSP blocks for high-speed multiply-accumulate operations, and 12 transceiver channels that operate at serial data rates up to 6.375 Gbps per the Stratix II GX device handbook. The 780-pin flip-chip BGA package supports high I/O count with signal integrity for high-speed parallel and serial interfaces. The device is fabricated on a 90 nm CMOS process and uses 1.2 V core supply with separate VCCIO banks for mixed-voltage I/O interfacing.
Architecture-wise, the Stratix II GX uses an ALM-based fabric rather than the older 4-input LUT approach, doubling effective logic capacity per area. On-chip TriMatrix memory supports true dual-port, simple dual-port, and single-port RAM/ROM configurations. The transceiver blocks include clock data recovery (CDR), pre-emphasis, and equalization, supporting standards such as PCI Express, Serial RapidIO, Gigabit Ethernet, XAUI, and CEI-6G.
Typical applications include high-speed serial interface bridging (PCIe, Serial RapidIO), telecommunication line cards, multi-gigabit serial backplanes, video broadcast equipment, and DSP prototyping for radar and baseband processing. The 780-FBGA package also makes the device suitable for designs that require many LVDS or DDR memory interfaces on the parallel side.
Design consideration: Stratix II GX designs require the Quartus II design software for synthesis, place-and-route, and timing closure. Power estimation must include both the logic fabric and the active MGT channels, since transceivers can dominate total power consumption when all 12 channels are active.
This page synthesizes distributor stock levels, drop-in package and speed-grade alternatives from the Stratix II GX family, and practical design notes not duplicated on the manufacturer datasheet.
Drop-in-Alternativen für EP2SGX60DF780C5N – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit EP2SGX60DF780C5N (gleiche Bauform und Footprint) – abweichend in Package, Speed Grade, RoHS Status, Operating Temperature, DSP Blocks.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
EP2SGX60DF780C5
✅ Drop-In✓ Auf Lager
$860.69 / Stück
Datenblatt ansehen →EP2SGX60DF780C4N
✅ Drop-In✓ Auf Lager
$365 / Stück
Datenblatt ansehen →EP2SGX60DF780C4
✅ Drop-In✓ Auf Lager
$1350 / Stück
Datenblatt ansehen →EP2SGX60DF780C3N
✅ Drop-In✓ Auf Lager
$188 / Stück
Datenblatt ansehen →EP2SGX60DF780C3
✅ Drop-In✓ Auf Lager
$218 / Stück
Datenblatt ansehen →EP2SGX60DF780C5N Grenzwerte & elektrische Eigenschaften
| Family | Stratix II GX |
| Logic Elements | 60,440 |
| Number of LABs/CLBs | 3,022 |
| Embedded Memory (bits) | 2,544,192 (≈2.5 Mb) |
| User I/O Count | 364 |
| Number of Transceivers | 12 |
| Max Transceiver Data Rate | 6.375 Gbps |
| Internal Frequency (max) | 609.76 MHz |
| Process Technology | 90 nm CMOS |
| Core Supply Voltage | 1.2 V |
| Package Type | 780-pin Flip-Chip BGA (FBGA-780) |
| Operating Temperature Grade | Commercial |
| Speed Grade | 5 (lower speed, higher Fmax margin) |
| Montageart | Surface Mount (BGA) |
| Design Software | Quartus II |
EP2SGX60DF780C5N 780-pin flip-chip bga (fbga-780) Pinbelegungsleitfaden
Pinbelegung für EP2SGX60DF780C5N (780-pin flip-chip bga (fbga-780)-Gehäuse). Dieser digitale IC umfasst GPIO, Kommunikationsschnittstellen (UART, SPI, I2C) und Versorgungspins. Alternative Pin-Funktionen und Konfigurationsoptionen entnehmen Sie dem Herstellerdatenblatt. Unverzichtbar für Embedded-System-Design und PCB-Layout.
Keine detaillierten Pinbelegungsdaten verfügbar für EP2SGX60DF780C5N.
Siehe die Datenblatt für die vollständige Pin-Konfiguration.
Typische Anwendungen
EP2SGX60DF780C5N ist geeignet für 6 Anwendungs: PCI Express Endpoint / Root Complex, Serial RapidIO Switch / Endpoint, Telecommunication Line Card Aggregation, Video Broadcast / Studio Equipment, Multi-Gigabit Serial Backplane / ATCA, Radar / DSP Prototyping Platform.
PCI Express Endpoint / Root Complex
The EP2SGX60DF780C5N is well suited for PCI Express Gen1 (2.5 Gbps) and Gen2 (5.0 Gbps) endpoint and root-complex designs. Its 12 multi-gigabit transceivers support up to an ×8 Gen2 link using the Altera PCIe hard IP, with on-chip clock data recovery (CDR) and pre-emphasis eliminating external PHY components. The 60,440 logic elements and 2,544,192 bits of embedded memory provide ample fabric for protocol-stack logic, DMA engines, and endpoint application layers, while the 780-FBGA package offers clean signal-integrity routing for both the PCIe lanes and the parallel side of the design.
Empfohlen
Serial RapidIO Switch / Endpoint
Serial RapidIO (sRIO) at 1.25, 2.5, and 3.125 Gbps fits naturally within the EP2SGX60DF780C5N's transceiver capabilities. The device's 12 transceivers allow multiple 1× or 4× sRIO links, while the 60,440 LEs host switch-fabric logic, routing tables, and congestion management. Embedded memory of 2.5 Mb buffers packet payloads between sRIO ports. The 780-FBGA package supports the necessary I/O for local bus interfaces to DSP clusters or PowerPC processors in wireless base-station line cards.
Empfohlen
Telecommunication Line Card Aggregation
Telecom line cards aggregating multiple E1/T1, SONET, or Ethernet channels benefit from the EP2SGX60DF780C5N's transceiver-rich architecture. Up to 12 serial channels handle backplane interconnect at multi-gigabit rates, while the embedded DSP blocks accelerate channel coding, scrambling, and clock-recovery functions. The 364 user I/Os connect to framer ICs, TDM switching fabrics, and external memory (DDR/QDR), all within a single package that simplifies line-card PCB layout. Industrial-grade variants in the same family address outdoor cabinet deployments.
Empfohlen
Video Broadcast / Studio Equipment
Broadcast video routers, format converters, and SDI embedder/de-embedder cards leverage the EP2SGX60DF780C5N's serial transceivers for SDI, HD-SDI, and 3G-SDI transport at 270 Mbps, 1.485 Gbps, and 2.97 Gbps. The embedded memory and DSP blocks handle pixel-rate processing, color-space conversion, and audio embedding with deterministic latency. The 364 I/Os drive parallel video buses (BT.656, BT.1120) to companion encoder/decoder ASICs, while the 780-FBGA package accommodates the dense pinout required for multi-channel video I/O.
Empfohlen
Multi-Gigabit Serial Backplane / ATCA
AdvancedTCA (ATCA) and proprietary multi-gigabit backplanes use the EP2SGX60DF780C5N as a fabric-interface device, leveraging the 12 transceivers for redundant fabric channels running at 3.125 or 6.25 Gbps. The ALM-based fabric implements SERDES aggregation, packet classification, and forwarding at line rate. The 780-FBGA package's thermal performance supports the high switching activity of active backplanes, while 2.5 Mb of embedded RAM holds routing tables and statistics counters. Multiple boards populated with this device can interoperate through industry-standard ATCA backplane topologies.
Empfohlen
Radar / DSP Prototyping Platform
Radar baseband processing and DSP prototyping platforms use the EP2SGX60DF780C5N as a high-density arithmetic engine thanks to its embedded DSP blocks supporting 18×18 multiplies at high clock rates. The 60,440 LEs deliver ample parallelism for FFT, pulse-compression, and beamforming algorithms, while the transceivers stream digitized IF data from ADC cards at multi-gigabit rates. 2.5 Mb of embedded RAM holds coefficient tables and intermediate vectors. The 780-FBGA package supports DDR/QDR memory interfaces for bulk data storage during processing.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für EP2SGX60DF780C5N – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | EP2SGX60DF780C5 | EP2SGX60DF780C4N | EP2SGX60DF780C4 | EP2SGX60DF780C3N | EP2SGX60DF780C3 |
|---|---|---|---|---|---|---|
| Brand | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) |
| Package | 780-FBGA (flip-chip BGA) | 780-FBGA - same | 780-FBGA - same | 780-FBGA - same | 780-FBGA - same | 780-FBGA - same |
| Logic Elements | 60,440 | 60,440 - same | 60,440 - same | 60,440 - same | 60,440 - same | 60,440 - same |
| Number of LABs/CLBs | 3,022 | 3,022 - same | 3,022 - same | 3,022 - same | 3,022 - same | 3,022 - same |
| Embedded Memory (bits) | 2,544,192 | 2,544,192 - same | 2,544,192 - same | 2,544,192 - same | 2,544,192 - same | 2,544,192 - same |
| User I/O Count | 364 | 364 - same | 364 - same | 364 - same | 364 - same | 364 - same |
| Number of Transceivers | 12 | 12 - same | 12 - same | 12 - same | 12 - same | 12 - same |
| Max Transceiver Data Rate | 6.375 Gbps | 6.375 Gbps - same | 6.375 Gbps - same | 6.375 Gbps - same | 6.375 Gbps - same | 6.375 Gbps - same |
| Speed Grade | 5 (slower, more Fmax margin) | 5 - same | 4 (faster) | 4 (faster) | 3 (fastest) | 3 (fastest) |
| Process Node | 90 nm | 90 nm - same | 90 nm - same | 90 nm - same | 90 nm - same | 90 nm - same |
Wichtigste Unterscheidungsmerkmale
- Same-package 60K-LE drop-in alternative with identical pinout (vs. EP2SGX60DF780C4N)
- Lowest-cost obsolete-stock variant of the same die (vs. EP2SGX60DF780C5)
- Fastest same-die speed grade for timing-critical paths (vs. EP2SGX60DF780C3N)
Designhinweise
The 780-pin flip-chip BGA package dissipates significant power when all 12 transceivers are active at 6.375 Gbps. Estimated: total power ≈ 12 × 200 mW (transceiver) + logic + I/O, which can exceed 10 W in worst-case designs. Apply a thermal solution with a heat spreader, thermal interface material, and adequate airflow (typically 200-400 LFM) to keep the junction below 85 °C for commercial-grade parts. Use Quartus II PowerPlay early power estimation to size the heatsink before PCB layout.
BGA fanout requires either a 4-layer or 6-layer PCB with microvia or via-in-pad construction to route 1 mm pitch BGA balls cleanly. Use buried capacitance in the stackup to provide low-impedance power delivery for the 1.2 V core rail, and place decoupling capacitors within 100 mils of each VCC pin. Reference the Altera Stratix II GX board design guidelines for the recommended stackup, decoupling scheme, and BGA escape routing rules.
Transceiver channels operating at 6.375 Gbps require controlled-impedance differential routing (typically 100 Ω differential), length matching within 5 mils between P and N, and via-stub minimization. Use the Stratix II GX device handbook's pre-emphasis and equalization settings to compensate for channel loss, and verify signal integrity with 3D EM simulation or measured VNA data before tapeout. The MGT reference clock must be routed with the same care as data lines.
Common pitfalls include using Quartus Prime 15.0+ which has dropped Stratix II GX support - pin the Quartus II 13.0 sp1 toolchain for this family. Also, configuration mode selection via MSEL pins must match the desired configuration scheme (AS, AP, FPP, PS); incorrect MSEL strapping prevents configuration. Finally, do not enable unused transceivers without proper termination - leave them in power-down mode via the ALTGXB megafunction to save power.
Compliance-Informationen
RoHS/REACH/lead-free status not explicitly confirmed in the Verified Web Data - mark as unknown and verify on the manufacturer's product page. AEC-Q100 not applicable for an FPGA.
