EP2SGX60DF780C3N vs EP2SGX60DF780I4N Vergleich
Detaillierter Direktvergleich von EP2SGX60DF780C3N von Intel und EP2SGX60DF780I4N von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | EP2SGX60DF780C3N | EP2SGX60DF780I4N |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Ende des Lebenszyklus | NRND |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $188,00 | $1.310,00 |
| Family | Stratix II GX | Stratix II GX |
| Device Type | FPGA | — |
| Logic Elements | 60,440 | 60,440 |
| LABs/CLBs | 3,022 | — |
| Total Memory Bits | 2,544,192 | — |
| User I/Os | 364 | — |
| Package Type | 780-pin FC-FBGA (DF780) | — |
| Package Dimensions | 23 x 23 mm | — |
| Pitch | 1 mm | — |
| Core Voltage | 1.2 V | 1.2 V |
| Process Technology | 90 nm | 90 nm CMOS |
| Internal Frequency | 717 MHz | — |
| Propagation Delay | [DATA_NEEDED: propagation delay ns] | — |
| Betriebstemperatur | [DATA_NEEDED: operating temperature range C] | -40C to +100C (industrial) |
| Montageart | Surface Mount (BGA) | — |
| RoHS-Status | Compliant (per distributor listing) | — |
| Logic Array Blocks (LABs) | — | 3,022 |
| User I/O Pins | — | 364 |
| Embedded Transceivers | — | Yes (multi-gigabit) |
| Transceiver Data Rate (max) | — | 6.375 Gbps |
| Gehäuse | — | FBGA-780 (DF) |
| Package Body Size | — | 29 x 29 mm |
| Ball Pitch | — | 1.0 mm |
| Lead Free | — | Yes |
| RoHS | — | Compliant |
| Maximum Internal Frequency | — | 732.1 MHz |