EP2SGX60DF780C3N vs EP2SGX60DF780I4N Comparación
Comparación detallada lado a lado de EP2SGX60DF780C3N por Intel y EP2SGX60DF780I4N por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | EP2SGX60DF780C3N | EP2SGX60DF780I4N |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Fin de vida | NRND |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $188,00 | $1.310,00 |
| Family | Stratix II GX | Stratix II GX |
| Device Type | FPGA | — |
| Logic Elements | 60,440 | 60,440 |
| LABs/CLBs | 3,022 | — |
| Total Memory Bits | 2,544,192 | — |
| User I/Os | 364 | — |
| Package Type | 780-pin FC-FBGA (DF780) | — |
| Package Dimensions | 23 x 23 mm | — |
| Pitch | 1 mm | — |
| Core Voltage | 1.2 V | 1.2 V |
| Process Technology | 90 nm | 90 nm CMOS |
| Internal Frequency | 717 MHz | — |
| Propagation Delay | [DATA_NEEDED: propagation delay ns] | — |
| Temperatura de funcionamiento | [DATA_NEEDED: operating temperature range C] | -40C to +100C (industrial) |
| Tipo de montaje | Surface Mount (BGA) | — |
| Estado RoHS | Compliant (per distributor listing) | — |
| Logic Array Blocks (LABs) | — | 3,022 |
| User I/O Pins | — | 364 |
| Embedded Transceivers | — | Yes (multi-gigabit) |
| Transceiver Data Rate (max) | — | 6.375 Gbps |
| Encapsulado | — | FBGA-780 (DF) |
| Package Body Size | — | 29 x 29 mm |
| Ball Pitch | — | 1.0 mm |
| Lead Free | — | Yes |
| RoHS | — | Compliant |
| Maximum Internal Frequency | — | 732.1 MHz |