EP2SGX60DF780C4 vs EP2SGX60DF780C3 Vergleich

Detaillierter Direktvergleich von EP2SGX60DF780C4 von Intel und EP2SGX60DF780C3 von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.

Spezifikationsvergleich

Parameter EP2SGX60DF780C4 EP2SGX60DF780C3
Marke Intel Intel
Kategorie FPGA & CPLD FPGA & CPLD
Lebenszyklusstatus NRND Obsolete
Lagerstatus In Stock In Stock
Stückpreis (USD) $1.350,00 $218,00
Device Family Stratix II GX —
Logic Elements 60,440 —
Embedded Memory Bits 2,544,192 —
User I/O Count 364 —
Maximum Internal Frequency 717 MHz —
Transceiver Channels [DATA_NEEDED: exact transceiver count and data rate] —
Number of CLBs 60,440 —
Process Technology 90 nm CMOS 90 nm
Core Supply Voltage 1.2 V —
Package Type 780-ball FC-FBGA —
Package Dimensions 29 x 29 mm —
Ball Pitch 1.0 mm —
Operating Temperature Grade Commercial (C) —
Speed Grade 4 (C4) C3 (fastest commercial)
Montageart Surface Mount Surface Mount
RoHS-Status Compliant Non-compliant (legacy Altera-era BGAs use SnPb or non-RoHS bump finish; verify per lot)
Family — Stratix II GX
Series — Stratix II
Logic Elements / Cells — 60,440
Logic Array Blocks (LABs) — 3,022
Total RAM Bits — [DATA_NEEDED: total embedded memory bits]
Number of I/O — 364
Number of Transceivers — Up to 20
Transceiver Data Rate — Up to 6.375 Gbps
Core Voltage — 1.2 V
Internal Frequency (max) — ~717 MHz
Gehäuse — 780-ball FC-FBGA (FineLine BGA), 29 x 29 mm, 1.0 mm pitch
Operating Temperature (TJ) — 0 °C to +85 °C (commercial, C speed grade)

Datenblätter & Ressourcen

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