EP2SGX60DF780C4 vs EP2SGX60DF780C3 Comparison

Detailed side-by-side comparison of EP2SGX60DF780C4 by Intel and EP2SGX60DF780C3 by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Specification Comparison

Parameter EP2SGX60DF780C4 EP2SGX60DF780C3
Brand Intel Intel
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Nrnd Obsolete
Stock Status In Stock In Stock
Unit Price (USD) $1,350.00 $218.00
Device Family Stratix II GX β€”
Logic Elements 60,440 β€”
Embedded Memory Bits 2,544,192 β€”
User I/O Count 364 β€”
Maximum Internal Frequency 717 MHz β€”
Transceiver Channels [DATA_NEEDED: exact transceiver count and data rate] β€”
Number of CLBs 60,440 β€”
Process Technology 90 nm CMOS 90 nm
Core Supply Voltage 1.2 V β€”
Package Type 780-ball FC-FBGA β€”
Package Dimensions 29 x 29 mm β€”
Ball Pitch 1.0 mm β€”
Operating Temperature Grade Commercial (C) β€”
Speed Grade 4 (C4) C3 (fastest commercial)
Mounting Type Surface Mount Surface Mount
RoHS Status Compliant Non-compliant (legacy Altera-era BGAs use SnPb or non-RoHS bump finish; verify per lot)
Family β€” Stratix II GX
Series β€” Stratix II
Logic Elements / Cells β€” 60,440
Logic Array Blocks (LABs) β€” 3,022
Total RAM Bits β€” [DATA_NEEDED: total embedded memory bits]
Number of I/O β€” 364
Number of Transceivers β€” Up to 20
Transceiver Data Rate β€” Up to 6.375 Gbps
Core Voltage β€” 1.2 V
Internal Frequency (max) β€” ~717 MHz
Package β€” 780-ball FC-FBGA (FineLine BGA), 29 x 29 mm, 1.0 mm pitch
Operating Temperature (TJ) β€” 0 Β°C to +85 Β°C (commercial, C speed grade)

Datasheets & Resources

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