EP2SGX60DF780C4 vs EP2SGX60DF780C3 Comparaison
Comparaison détaillée côte à côte de EP2SGX60DF780C4 par Intel et EP2SGX60DF780C3 par Intel. Comparez les spécifications clés, les paramètres électriques, le conditionnement, le statut de cycle de vie, les prix et la disponibilité pour déterminer le meilleur composant pour vos exigences de conception.
Comparaison des spécifications
| Paramètre | EP2SGX60DF780C4 | EP2SGX60DF780C3 |
|---|---|---|
| Marque | Intel | Intel |
| Catégorie | FPGA & CPLD | FPGA & CPLD |
| Statut du cycle de vie | NRND | Obsolete |
| Statut du stock | In Stock | In Stock |
| Prix unitaire (USD) | $1 350,00 | $218,00 |
| Device Family | Stratix II GX | — |
| Logic Elements | 60,440 | — |
| Embedded Memory Bits | 2,544,192 | — |
| User I/O Count | 364 | — |
| Maximum Internal Frequency | 717 MHz | — |
| Transceiver Channels | [DATA_NEEDED: exact transceiver count and data rate] | — |
| Number of CLBs | 60,440 | — |
| Process Technology | 90 nm CMOS | 90 nm |
| Core Supply Voltage | 1.2 V | — |
| Package Type | 780-ball FC-FBGA | — |
| Package Dimensions | 29 x 29 mm | — |
| Ball Pitch | 1.0 mm | — |
| Operating Temperature Grade | Commercial (C) | — |
| Speed Grade | 4 (C4) | C3 (fastest commercial) |
| Type de montage | Surface Mount | Surface Mount |
| Statut RoHS | Compliant | Non-compliant (legacy Altera-era BGAs use SnPb or non-RoHS bump finish; verify per lot) |
| Family | — | Stratix II GX |
| Series | — | Stratix II |
| Logic Elements / Cells | — | 60,440 |
| Logic Array Blocks (LABs) | — | 3,022 |
| Total RAM Bits | — | [DATA_NEEDED: total embedded memory bits] |
| Number of I/O | — | 364 |
| Number of Transceivers | — | Up to 20 |
| Transceiver Data Rate | — | Up to 6.375 Gbps |
| Core Voltage | — | 1.2 V |
| Internal Frequency (max) | — | ~717 MHz |
| Boîtier | — | 780-ball FC-FBGA (FineLine BGA), 29 x 29 mm, 1.0 mm pitch |
| Operating Temperature (TJ) | — | 0 °C to +85 °C (commercial, C speed grade) |