EP2SGX60DF780C4N vs EP2SGX60DF780C3 Vergleich
Detaillierter Direktvergleich von EP2SGX60DF780C4N von Intel und EP2SGX60DF780C3 von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Intel
EP2SGX60DF780C4N - Stratix II GX FPGA, 60K LEs, 364 I/O, FBGA-780 | Intel
EP2SGX60DF780C4N Obsolete
Spezifikationsvergleich
| Parameter | EP2SGX60DF780C4N | EP2SGX60DF780C3 |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Obsolete | Obsolete |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $365,00 | $218,00 |
| Family | Stratix II GX | Stratix II GX |
| Logic Elements | 60,440 | — |
| Logic Array Blocks (LABs) | 3,022 | 3,022 |
| Adaptive Logic Modules (ALMs) | 24,176 | — |
| User I/Os | 364 | — |
| Total RAM Bits | 2,544,192 | [DATA_NEEDED: total embedded memory bits] |
| Embedded Multipliers (18x18) | 144 | — |
| DSP Blocks | 36 | — |
| Transceivers | Up to 20 (up to 6.375 Gbps) | — |
| PLLs | 4 | — |
| Global Clock Networks | 16 | — |
| Core Voltage | 1.2 V | 1.2 V |
| Process Node | 90 nm CMOS | — |
| Gehäuse | 780-ball FBGA (29 x 29 mm, 1.0 mm pitch) | 780-ball FC-FBGA (FineLine BGA), 29 x 29 mm, 1.0 mm pitch |
| Maximum Internal Frequency | 717 MHz | — |
| Betriebstemperatur | Commercial 0C to +85C | — |
| Speed Grade | C4 | C3 (fastest commercial) |
| RoHS-Status | Lead-free (per part suffix N) | Non-compliant (legacy Altera-era BGAs use SnPb or non-RoHS bump finish; verify per lot) |
| Series | — | Stratix II |
| Logic Elements / Cells | — | 60,440 |
| Number of I/O | — | 364 |
| Number of Transceivers | — | Up to 20 |
| Transceiver Data Rate | — | Up to 6.375 Gbps |
| Process Technology | — | 90 nm |
| Internal Frequency (max) | — | ~717 MHz |
| Montageart | — | Surface Mount |
| Operating Temperature (TJ) | — | 0 °C to +85 °C (commercial, C speed grade) |