EP2SGX60DF780C4N vs EP2SGX60DF780C3 Comparação
Comparação detalhada lado a lado de EP2SGX60DF780C4N por Intel e EP2SGX60DF780C3 por Intel. Compare especificações principais, parâmetros elétricos, encapsulamento, status do ciclo de vida, preços e disponibilidade para determinar o melhor componente para os requisitos do seu projeto.
Intel
EP2SGX60DF780C4N - Stratix II GX FPGA, 60K LEs, 364 I/O, FBGA-780 | Intel
EP2SGX60DF780C4N Obsolete
Comparação de especificações
| Parâmetro | EP2SGX60DF780C4N | EP2SGX60DF780C3 |
|---|---|---|
| Marca | Intel | Intel |
| Categoria | FPGA & CPLD | FPGA & CPLD |
| Status do ciclo de vida | Obsolete | Obsolete |
| Status do estoque | In Stock | In Stock |
| Preço unitário (USD) | $365,00 | $218,00 |
| Family | Stratix II GX | Stratix II GX |
| Logic Elements | 60,440 | — |
| Logic Array Blocks (LABs) | 3,022 | 3,022 |
| Adaptive Logic Modules (ALMs) | 24,176 | — |
| User I/Os | 364 | — |
| Total RAM Bits | 2,544,192 | [DATA_NEEDED: total embedded memory bits] |
| Embedded Multipliers (18x18) | 144 | — |
| DSP Blocks | 36 | — |
| Transceivers | Up to 20 (up to 6.375 Gbps) | — |
| PLLs | 4 | — |
| Global Clock Networks | 16 | — |
| Core Voltage | 1.2 V | 1.2 V |
| Process Node | 90 nm CMOS | — |
| Encapsulamento | 780-ball FBGA (29 x 29 mm, 1.0 mm pitch) | 780-ball FC-FBGA (FineLine BGA), 29 x 29 mm, 1.0 mm pitch |
| Maximum Internal Frequency | 717 MHz | — |
| Temperatura de operação | Commercial 0C to +85C | — |
| Speed Grade | C4 | C3 (fastest commercial) |
| Status RoHS | Lead-free (per part suffix N) | Non-compliant (legacy Altera-era BGAs use SnPb or non-RoHS bump finish; verify per lot) |
| Series | — | Stratix II |
| Logic Elements / Cells | — | 60,440 |
| Number of I/O | — | 364 |
| Number of Transceivers | — | Up to 20 |
| Transceiver Data Rate | — | Up to 6.375 Gbps |
| Process Technology | — | 90 nm |
| Internal Frequency (max) | — | ~717 MHz |
| Tipo de montagem | — | Surface Mount |
| Operating Temperature (TJ) | — | 0 °C to +85 °C (commercial, C speed grade) |