EP2SGX60EF1152I3 vs EP2SGX60EF1152I3N Vergleich
Detaillierter Direktvergleich von EP2SGX60EF1152I3 von Intel und EP2SGX60EF1152I3N von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Intel
EP2SGX60EF1152I3 - 60K LEs Stratix II GX FPGA, 1152-BGA, Industrial | Intel
EP2SGX60EF1152I3 Obsolete
Spezifikationsvergleich
| Parameter | EP2SGX60EF1152I3 | EP2SGX60EF1152I3N |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Obsolete | Obsolete |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $365,00 | $1.195,00 |
| Family | Stratix II GX | Stratix II GX |
| Series | EP2SGX60 | — |
| Logic Elements (LEs) | 60,440 | 60,440 |
| Adaptive Logic Modules (ALMs) | 30,220 (estimated from LEs) | — |
| Equivalent Logic Cells (CLBs) | 60,440 | — |
| Embedded Memory (Bits) | 2,544,192 bits (per DigiKey listing for the I4N variant) | — |
| Maximum Internal Frequency | 717 MHz | — |
| Combinational Delay (per CLB) | 2.99 ns | — |
| Multi-Gigabit Transceivers | [DATA_NEEDED: exact count for EP2SGX60] | — |
| Maximum Transceiver Data Rate | 6.375 Gbps (per Stratix II GX family spec) | — |
| Total RAM Bits | 2,544,192 bits | — |
| Gehäuse | 1152-ball FBGA, 35 mm x 35 mm, 1 mm pitch | — |
| Pin/Ball Count | 1152 | — |
| Montageart | Surface Mount (BGA) | Surface Mount (BGA) |
| Betriebstemperatur | -40C to +100C (Industrial, I3 speed grade) | — |
| Speed Grade | I3 (Industrial) | — |
| Configuration Mode | Enhanced (EPC) - fast parallel via external memory | — |
| Process Technology | 90 nm CMOS | 90 nm |
| RoHS-Status | [DATA_NEEDED: not in retrieved snippets] | Compliant |
| Device Type | — | Field-Programmable Gate Array (FPGA) |
| Configurable Logic Blocks (CLBs) | — | 60,440 |
| Embedded Memory Bits | — | 2,544,192 bits |
| Internal Frequency (max) | — | 717 MHz |
| Core Voltage | — | 1.2 V |
| Package Type | — | 1152-ball FC-FBGA |
| Package Size | — | 35 x 35 mm (1 mm ball pitch) |
| Number of Terminals | — | 1152 |
| Terminal Form | — | Ball |
| Temperature Grade | — | Industrial (-40C to +100C junction) |
| Lead-Free | — | Yes |
| MSL-Level | — | [DATA_NEEDED: MSL level] |