EP2SGX60EF1152I3 vs EP2SGX60EF1152I4 Vergleich

Detaillierter Direktvergleich von EP2SGX60EF1152I3 von Intel und EP2SGX60EF1152I4 von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.

Spezifikationsvergleich

Parameter EP2SGX60EF1152I3 EP2SGX60EF1152I4
Marke Intel Intel
Kategorie FPGA & CPLD FPGA & CPLD
Lebenszyklusstatus Obsolete Aktiv
Lagerstatus In Stock In Stock
Stückpreis (USD) $365,00 $1.395,00
Family Stratix II GX —
Series EP2SGX60 —
Logic Elements (LEs) 60,440 —
Adaptive Logic Modules (ALMs) 30,220 (estimated from LEs) —
Equivalent Logic Cells (CLBs) 60,440 —
Embedded Memory (Bits) 2,544,192 bits (per DigiKey listing for the I4N variant) —
Maximum Internal Frequency 717 MHz 717 MHz (per data source)
Combinational Delay (per CLB) 2.99 ns —
Multi-Gigabit Transceivers [DATA_NEEDED: exact count for EP2SGX60] —
Maximum Transceiver Data Rate 6.375 Gbps (per Stratix II GX family spec) —
Total RAM Bits 2,544,192 bits —
Gehäuse 1152-ball FBGA, 35 mm x 35 mm, 1 mm pitch 1152-ball FC-FBGA (flip-chip fine-pitch BGA)
Pin/Ball Count 1152 —
Montageart Surface Mount (BGA) Surface Mount (BGA)
Betriebstemperatur -40C to +100C (Industrial, I3 speed grade) —
Speed Grade I3 (Industrial) —
Configuration Mode Enhanced (EPC) - fast parallel via external memory —
Process Technology 90 nm CMOS 90 nm CMOS
RoHS-Status [DATA_NEEDED: not in retrieved snippets] [DATA_NEEDED: RoHS status]
Device Family — Stratix II GX
Logic Elements — 60,440
Logic Cells — 60,440
Logic Array Blocks (LABs) — 3,022
Embedded Memory — 2,544,192 bits
User I/O Pins — 534
Maximum Operating Frequency — 732.1 MHz (per data source)
Core Supply Voltage — 1.2 V
Package Dimensions — 23 x 23 mm, 1 mm pitch (per data source)
Temperature Grade — Industrial

Datenblätter & Ressourcen

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