EP2SGX60EF1152I3 vs EP2SGX60EF1152I4 Comparaison
Comparaison détaillée côte à côte de EP2SGX60EF1152I3 par Intel et EP2SGX60EF1152I4 par Intel. Comparez les spécifications clés, les paramètres électriques, le conditionnement, le statut de cycle de vie, les prix et la disponibilité pour déterminer le meilleur composant pour vos exigences de conception.
Intel
EP2SGX60EF1152I3 - 60K LEs Stratix II GX FPGA, 1152-BGA, Industrial | Intel
EP2SGX60EF1152I3 Obsolete
Comparaison des spécifications
| Paramètre | EP2SGX60EF1152I3 | EP2SGX60EF1152I4 |
|---|---|---|
| Marque | Intel | Intel |
| Catégorie | FPGA & CPLD | FPGA & CPLD |
| Statut du cycle de vie | Obsolete | Actif |
| Statut du stock | In Stock | In Stock |
| Prix unitaire (USD) | $365,00 | $1 395,00 |
| Family | Stratix II GX | — |
| Series | EP2SGX60 | — |
| Logic Elements (LEs) | 60,440 | — |
| Adaptive Logic Modules (ALMs) | 30,220 (estimated from LEs) | — |
| Equivalent Logic Cells (CLBs) | 60,440 | — |
| Embedded Memory (Bits) | 2,544,192 bits (per DigiKey listing for the I4N variant) | — |
| Maximum Internal Frequency | 717 MHz | 717 MHz (per data source) |
| Combinational Delay (per CLB) | 2.99 ns | — |
| Multi-Gigabit Transceivers | [DATA_NEEDED: exact count for EP2SGX60] | — |
| Maximum Transceiver Data Rate | 6.375 Gbps (per Stratix II GX family spec) | — |
| Total RAM Bits | 2,544,192 bits | — |
| Boîtier | 1152-ball FBGA, 35 mm x 35 mm, 1 mm pitch | 1152-ball FC-FBGA (flip-chip fine-pitch BGA) |
| Pin/Ball Count | 1152 | — |
| Type de montage | Surface Mount (BGA) | Surface Mount (BGA) |
| Température de fonctionnement | -40C to +100C (Industrial, I3 speed grade) | — |
| Speed Grade | I3 (Industrial) | — |
| Configuration Mode | Enhanced (EPC) - fast parallel via external memory | — |
| Process Technology | 90 nm CMOS | 90 nm CMOS |
| Statut RoHS | [DATA_NEEDED: not in retrieved snippets] | [DATA_NEEDED: RoHS status] |
| Device Family | — | Stratix II GX |
| Logic Elements | — | 60,440 |
| Logic Cells | — | 60,440 |
| Logic Array Blocks (LABs) | — | 3,022 |
| Embedded Memory | — | 2,544,192 bits |
| User I/O Pins | — | 534 |
| Maximum Operating Frequency | — | 732.1 MHz (per data source) |
| Core Supply Voltage | — | 1.2 V |
| Package Dimensions | — | 23 x 23 mm, 1 mm pitch (per data source) |
| Temperature Grade | — | Industrial |