EP2SGX60EF1152I3 vs EP2SGX60EF1152I4 对比
详细并排对比 EP2SGX60EF1152I3 出自 Intel 和 EP2SGX60EF1152I4 出自 Intel。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况，以确定最适合您设计需求的元器件。
Intel
EP2SGX60EF1152I3 - 60K LEs Stratix II GX FPGA, 1152-BGA, Industrial | Intel
EP2SGX60EF1152I3 Obsolete
规格对比
| 参数 | EP2SGX60EF1152I3 | EP2SGX60EF1152I4 |
|---|---|---|
| 品牌 | Intel | Intel |
| 分类 | FPGA & CPLD | FPGA & CPLD |
| 生命周期状态 | Obsolete | 有效 |
| 库存状态 | 有库存 | 有库存 |
| 单价（USD） | $365.00 | $1,395.00 |
| Family | Stratix II GX | — |
| Series | EP2SGX60 | — |
| Logic Elements (LEs) | 60,440 | — |
| Adaptive Logic Modules (ALMs) | 30,220 (estimated from LEs) | — |
| Equivalent Logic Cells (CLBs) | 60,440 | — |
| Embedded Memory (Bits) | 2,544,192 bits (per DigiKey listing for the I4N variant) | — |
| Maximum Internal Frequency | 717 MHz | 717 MHz (per data source) |
| Combinational Delay (per CLB) | 2.99 ns | — |
| Multi-Gigabit Transceivers | [DATA_NEEDED: exact count for EP2SGX60] | — |
| Maximum Transceiver Data Rate | 6.375 Gbps (per Stratix II GX family spec) | — |
| Total RAM Bits | 2,544,192 bits | — |
| 封装 | 1152-ball FBGA, 35 mm x 35 mm, 1 mm pitch | 1152-ball FC-FBGA (flip-chip fine-pitch BGA) |
| Pin/Ball Count | 1152 | — |
| 安装类型 | Surface Mount (BGA) | Surface Mount (BGA) |
| 工作温度 | -40C to +100C (Industrial, I3 speed grade) | — |
| Speed Grade | I3 (Industrial) | — |
| Configuration Mode | Enhanced (EPC) - fast parallel via external memory | — |
| Process Technology | 90 nm CMOS | 90 nm CMOS |
| RoHS 状态 | [DATA_NEEDED: not in retrieved snippets] | [DATA_NEEDED: RoHS status] |
| Device Family | — | Stratix II GX |
| Logic Elements | — | 60,440 |
| Logic Cells | — | 60,440 |
| Logic Array Blocks (LABs) | — | 3,022 |
| Embedded Memory | — | 2,544,192 bits |
| User I/O Pins | — | 534 |
| Maximum Operating Frequency | — | 732.1 MHz (per data source) |
| Core Supply Voltage | — | 1.2 V |
| Package Dimensions | — | 23 x 23 mm, 1 mm pitch (per data source) |
| Temperature Grade | — | Industrial |