EP2SGX60EF1152I3N vs EP2SGX60EF1152I3 Vergleich
Detaillierter Direktvergleich von EP2SGX60EF1152I3N von Intel und EP2SGX60EF1152I3 von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Intel
EP2SGX60EF1152I3 - 60K LEs Stratix II GX FPGA, 1152-BGA, Industrial | Intel
EP2SGX60EF1152I3 ObsoleteSpezifikationsvergleich
| Parameter | EP2SGX60EF1152I3N | EP2SGX60EF1152I3 |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Obsolete | Obsolete |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $1.195,00 | $365,00 |
| Family | Stratix II GX | Stratix II GX |
| Device Type | Field-Programmable Gate Array (FPGA) | — |
| Logic Elements (LEs) | 60,440 | 60,440 |
| Configurable Logic Blocks (CLBs) | 60,440 | — |
| Embedded Memory Bits | 2,544,192 bits | — |
| Internal Frequency (max) | 717 MHz | — |
| Process Technology | 90 nm | 90 nm CMOS |
| Core Voltage | 1.2 V | — |
| Package Type | 1152-ball FC-FBGA | — |
| Package Size | 35 x 35 mm (1 mm ball pitch) | — |
| Number of Terminals | 1152 | — |
| Terminal Form | Ball | — |
| Temperature Grade | Industrial (-40C to +100C junction) | — |
| Lead-Free | Yes | — |
| RoHS-Status | Compliant | [DATA_NEEDED: not in retrieved snippets] |
| MSL-Level | [DATA_NEEDED: MSL level] | — |
| Montageart | Surface Mount (BGA) | Surface Mount (BGA) |
| Series | — | EP2SGX60 |
| Adaptive Logic Modules (ALMs) | — | 30,220 (estimated from LEs) |
| Equivalent Logic Cells (CLBs) | — | 60,440 |
| Embedded Memory (Bits) | — | 2,544,192 bits (per DigiKey listing for the I4N variant) |
| Maximum Internal Frequency | — | 717 MHz |
| Combinational Delay (per CLB) | — | 2.99 ns |
| Multi-Gigabit Transceivers | — | [DATA_NEEDED: exact count for EP2SGX60] |
| Maximum Transceiver Data Rate | — | 6.375 Gbps (per Stratix II GX family spec) |
| Total RAM Bits | — | 2,544,192 bits |
| Gehäuse | — | 1152-ball FBGA, 35 mm x 35 mm, 1 mm pitch |
| Pin/Ball Count | — | 1152 |
| Betriebstemperatur | — | -40C to +100C (Industrial, I3 speed grade) |
| Speed Grade | — | I3 (Industrial) |
| Configuration Mode | — | Enhanced (EPC) - fast parallel via external memory |