EP2SGX60EF1152I3N vs EP2SGX60EF1152I3 비교

다음의 상세 나란히 비교: EP2SGX60EF1152I3N 제조: Intel 및 EP2SGX60EF1152I3 제조: Intel. 주요 사양, 전기적 파라미터, 패키징, 수명 주기 상태, 가격 및 재고를 비교하여 설계 요구 사항에 가장 적합한 부품을 결정하십시오.

사양 비교

파라미터 EP2SGX60EF1152I3N EP2SGX60EF1152I3
브랜드 Intel Intel
카테고리 FPGA & CPLD FPGA & CPLD
수명 주기 상태 Obsolete Obsolete
재고 상태 In Stock In Stock
단가 (USD) $1,195.00 $365.00
Family Stratix II GX Stratix II GX
Device Type Field-Programmable Gate Array (FPGA) —
Logic Elements (LEs) 60,440 60,440
Configurable Logic Blocks (CLBs) 60,440 —
Embedded Memory Bits 2,544,192 bits —
Internal Frequency (max) 717 MHz —
Process Technology 90 nm 90 nm CMOS
Core Voltage 1.2 V —
Package Type 1152-ball FC-FBGA —
Package Size 35 x 35 mm (1 mm ball pitch) —
Number of Terminals 1152 —
Terminal Form Ball —
Temperature Grade Industrial (-40C to +100C junction) —
Lead-Free Yes —
RoHS 상태 Compliant [DATA_NEEDED: not in retrieved snippets]
MSL 레벨 [DATA_NEEDED: MSL level] —
실장 유형 Surface Mount (BGA) Surface Mount (BGA)
Series — EP2SGX60
Adaptive Logic Modules (ALMs) — 30,220 (estimated from LEs)
Equivalent Logic Cells (CLBs) — 60,440
Embedded Memory (Bits) — 2,544,192 bits (per DigiKey listing for the I4N variant)
Maximum Internal Frequency — 717 MHz
Combinational Delay (per CLB) — 2.99 ns
Multi-Gigabit Transceivers — [DATA_NEEDED: exact count for EP2SGX60]
Maximum Transceiver Data Rate — 6.375 Gbps (per Stratix II GX family spec)
Total RAM Bits — 2,544,192 bits
패키지 — 1152-ball FBGA, 35 mm x 35 mm, 1 mm pitch
Pin/Ball Count — 1152
동작 온도 — -40C to +100C (Industrial, I3 speed grade)
Speed Grade — I3 (Industrial)
Configuration Mode — Enhanced (EPC) - fast parallel via external memory

데이터시트 & 자료

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