EP2SGX60EF1152I5 vs EP2SGX60EF1152I3N Vergleich
Detaillierter Direktvergleich von EP2SGX60EF1152I5 von Intel und EP2SGX60EF1152I3N von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | EP2SGX60EF1152I5 | EP2SGX60EF1152I3N |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Obsolete | Obsolete |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $178,00 | $1.195,00 |
| Family | Stratix II GX | Stratix II GX |
| Logic Elements (LEs) | 60,440 | 60,440 |
| Configurable Logic Blocks (CLBs) | 60,440 | 60,440 |
| Embedded Memory (bits) | 2,544,192 | — |
| Maximale Taktfrequenz | 622.08 MHz | — |
| Process Technology | 90 nm CMOS | 90 nm |
| Core Supply Voltage | 1.15 V to 1.25 V | — |
| Operating Temperature Grade | Industrial (-40 °C to +85 °C) | — |
| Gehäuse | 1152-ball FC-FBGA (PBGA1152), 35 x 35 mm, 1.00 mm pitch | — |
| Montageart | Surface Mount (flip-chip BGA) | Surface Mount (BGA) |
| Terminal Form | Ball | Ball |
| Number of Terminals | 1152 | 1152 |
| Package Code | BGA | — |
| MSL-Level | [DATA_NEEDED: MSL rating] | [DATA_NEEDED: MSL level] |
| RoHS-Status | [DATA_NEEDED: RoHS status] | Compliant |
| Transceivers | Integrated multi-gigabit transceivers (per Stratix II GX family) | — |
| DSP Blocks | Yes, hardware multipliers and DSP blocks (per Stratix II GX family) | — |
| Device Type | — | Field-Programmable Gate Array (FPGA) |
| Embedded Memory Bits | — | 2,544,192 bits |
| Internal Frequency (max) | — | 717 MHz |
| Core Voltage | — | 1.2 V |
| Package Type | — | 1152-ball FC-FBGA |
| Package Size | — | 35 x 35 mm (1 mm ball pitch) |
| Temperature Grade | — | Industrial (-40C to +100C junction) |
| Lead-Free | — | Yes |