EP2SGX60EF1152I5 vs EP2SGX60EF1152I3N Comparaison
Comparaison détaillée côte à côte de EP2SGX60EF1152I5 par Intel et EP2SGX60EF1152I3N par Intel. Comparez les spécifications clés, les paramètres électriques, le conditionnement, le statut de cycle de vie, les prix et la disponibilité pour déterminer le meilleur composant pour vos exigences de conception.
Comparaison des spécifications
| Paramètre | EP2SGX60EF1152I5 | EP2SGX60EF1152I3N |
|---|---|---|
| Marque | Intel | Intel |
| Catégorie | FPGA & CPLD | FPGA & CPLD |
| Statut du cycle de vie | Obsolete | Obsolete |
| Statut du stock | In Stock | In Stock |
| Prix unitaire (USD) | $178,00 | $1 195,00 |
| Family | Stratix II GX | Stratix II GX |
| Logic Elements (LEs) | 60,440 | 60,440 |
| Configurable Logic Blocks (CLBs) | 60,440 | 60,440 |
| Embedded Memory (bits) | 2,544,192 | — |
| Fréquence d'horloge maximale | 622.08 MHz | — |
| Process Technology | 90 nm CMOS | 90 nm |
| Core Supply Voltage | 1.15 V to 1.25 V | — |
| Operating Temperature Grade | Industrial (-40 °C to +85 °C) | — |
| Boîtier | 1152-ball FC-FBGA (PBGA1152), 35 x 35 mm, 1.00 mm pitch | — |
| Type de montage | Surface Mount (flip-chip BGA) | Surface Mount (BGA) |
| Terminal Form | Ball | Ball |
| Number of Terminals | 1152 | 1152 |
| Package Code | BGA | — |
| Niveau MSL | [DATA_NEEDED: MSL rating] | [DATA_NEEDED: MSL level] |
| Statut RoHS | [DATA_NEEDED: RoHS status] | Compliant |
| Transceivers | Integrated multi-gigabit transceivers (per Stratix II GX family) | — |
| DSP Blocks | Yes, hardware multipliers and DSP blocks (per Stratix II GX family) | — |
| Device Type | — | Field-Programmable Gate Array (FPGA) |
| Embedded Memory Bits | — | 2,544,192 bits |
| Internal Frequency (max) | — | 717 MHz |
| Core Voltage | — | 1.2 V |
| Package Type | — | 1152-ball FC-FBGA |
| Package Size | — | 35 x 35 mm (1 mm ball pitch) |
| Temperature Grade | — | Industrial (-40C to +100C junction) |
| Lead-Free | — | Yes |