EP2SGX60EF1152I5 vs EP2SGX60EF1152I5N Vergleich

Detaillierter Direktvergleich von EP2SGX60EF1152I5 von Intel und EP2SGX60EF1152I5N von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.

Spezifikationsvergleich

Parameter EP2SGX60EF1152I5 EP2SGX60EF1152I5N
Marke Intel Intel
Kategorie FPGA & CPLD FPGA & CPLD
Lebenszyklusstatus Obsolete Unknown
Lagerstatus In Stock In Stock
Stückpreis (USD) $178,00 $0,00
Family Stratix II GX Stratix II GX
Logic Elements (LEs) 60,440 —
Configurable Logic Blocks (CLBs) 60,440 —
Embedded Memory (bits) 2,544,192 —
Maximale Taktfrequenz 622.08 MHz 622.08 MHz
Process Technology 90 nm CMOS 90 nm CMOS
Core Supply Voltage 1.15 V to 1.25 V 1.2 V
Operating Temperature Grade Industrial (-40 °C to +85 °C) —
Gehäuse 1152-ball FC-FBGA (PBGA1152), 35 x 35 mm, 1.00 mm pitch 1152-ball BGA
Montageart Surface Mount (flip-chip BGA) —
Terminal Form Ball Ball
Number of Terminals 1152 1152
Package Code BGA —
MSL-Level [DATA_NEEDED: MSL rating] —
RoHS-Status [DATA_NEEDED: RoHS status] unknown
Transceivers Integrated multi-gigabit transceivers (per Stratix II GX family) —
DSP Blocks Yes, hardware multipliers and DSP blocks (per Stratix II GX family) —
Device Type — Field Programmable Gate Array (FPGA)
Logic Cells — 60,440
Logic Blocks — 60,440
Internal Frequency — 717 MHz
Reported Internal Frequency — 609.76 MHz
Betriebstemperaturbereich — -40 °C to 85 °C
Package Type — FC-FBGA
Package Dimensions — 23 x 23 mm
Terminal Pitch — 1 mm
Temperature Grade — Industrial
Propagation Delay — [DATA_NEEDED: propagation delay]
Configuration Memory — [DATA_NEEDED: configuration memory type and size]
I/O Count — [DATA_NEEDED: user I/O count]
Transceiver Count — [DATA_NEEDED: transceiver count]
REACH Status — unknown

Datenblätter & Ressourcen

Alle Produkte durchsuchen BOM erstellen Angebot anfordern