EP2SGX60EF1152I5N vs EP2SGX60EF1152I5 Vergleich

Detaillierter Direktvergleich von EP2SGX60EF1152I5N von Intel und EP2SGX60EF1152I5 von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.

Spezifikationsvergleich

Parameter EP2SGX60EF1152I5N EP2SGX60EF1152I5
Marke Intel Intel
Kategorie FPGA & CPLD FPGA & CPLD
Lebenszyklusstatus Unknown Obsolete
Lagerstatus In Stock In Stock
Stückpreis (USD) $0,00 $178,00
Device Type Field Programmable Gate Array (FPGA) —
Family Stratix II GX Stratix II GX
Logic Cells 60,440 —
Logic Blocks 60,440 —
Process Technology 90 nm CMOS 90 nm CMOS
Core Supply Voltage 1.2 V 1.15 V to 1.25 V
Internal Frequency 717 MHz —
Reported Internal Frequency 609.76 MHz —
Maximale Taktfrequenz 622.08 MHz 622.08 MHz
Betriebstemperaturbereich -40 °C to 85 °C —
Gehäuse 1152-ball BGA 1152-ball FC-FBGA (PBGA1152), 35 x 35 mm, 1.00 mm pitch
Package Type FC-FBGA —
Package Dimensions 23 x 23 mm —
Terminal Pitch 1 mm —
Number of Terminals 1152 1152
Terminal Form Ball Ball
Temperature Grade Industrial —
Propagation Delay [DATA_NEEDED: propagation delay] —
Configuration Memory [DATA_NEEDED: configuration memory type and size] —
I/O Count [DATA_NEEDED: user I/O count] —
Transceiver Count [DATA_NEEDED: transceiver count] —
RoHS-Status unknown [DATA_NEEDED: RoHS status]
REACH Status unknown —
Logic Elements (LEs) — 60,440
Configurable Logic Blocks (CLBs) — 60,440
Embedded Memory (bits) — 2,544,192
Operating Temperature Grade — Industrial (-40 °C to +85 °C)
Montageart — Surface Mount (flip-chip BGA)
Package Code — BGA
MSL-Level — [DATA_NEEDED: MSL rating]
Transceivers — Integrated multi-gigabit transceivers (per Stratix II GX family)
DSP Blocks — Yes, hardware multipliers and DSP blocks (per Stratix II GX family)

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