EP2SGX90EF1152C3ES vs EP2SGX90EF1152C5ES Vergleich

Detaillierter Direktvergleich von EP2SGX90EF1152C3ES von Intel und EP2SGX90EF1152C5ES von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.

Intel
EP2SGX90EF1152C3ES EP2SGX90EF1152C3ES - Stratix II GX FPGA 90nm 558 I/O 1152-BBGA | Intel

EP2SGX90EF1152C3ES - Stratix II GX FPGA 90nm 558 I/O 1152-BBGA | Intel

EP2SGX90EF1152C3ES ⚠ Letzte Bestellmöglichkeit

Spezifikationsvergleich

Parameter EP2SGX90EF1152C3ES EP2SGX90EF1152C5ES
Marke Intel Intel
Kategorie FPGA & CPLD FPGA & CPLD
Lebenszyklusstatus Letzte Kaufgelegenheit Obsolete
Lagerstatus In Stock In Stock
Stückpreis (USD) $2.050,00 $1.495,00
Family Stratix II GX Stratix II GX
Process Node 90 nm —
Logic Elements 90,960 90,960
Embedded Memory 4,520,448 bits (approx. 4.5 Mbit) —
User I/O Pins 558 —
Gehäuse 1152-BBGA (FineLine BGA, 35x35 mm) 1152-FBGA (FineLine BGA)
Speed Grade C3 C5 (commercial, mid-tier)
Temperature Grade Commercial Extended (-40 C to +100 C) —
Core Voltage 1.5 V (Enhanced, 'E' suffix) 1.2 V (typical)
High-Speed Transceivers Up to 12 channels (per Stratix II GX family) —
Transceiver Data Rate Up to 6.375 Gbps per channel (family spec) Up to 6.375 Gbps
DSP Blocks Yes, dedicated 18x18 multipliers and accumulators —
PLL Count [DATA_NEEDED: PLL count for EP2SGX90 variant] —
User I/O Banks 24 (per package datasheet) —
Configuration SRAM-based, supports Fast Passive Parallel, Fast Active Serial, JTAG —
Montageart Surface Mount (BGA) —
RoHS-Status Compliant Compliant
Lead-Free Yes Yes
Embedded Memory (bits) — 4,520,448
User I/Os — 558
Number of Transceivers — 12 (up to 20 channels)
DSP Blocks (18x18 multipliers) — 384
Betriebstemperatur — 0C to +85C (commercial)
Process Technology — 90 nm CMOS
Configuration Method — Fast passive parallel, active serial, JTAG

Datenblätter & Ressourcen

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