EP2SGX90EF1152C3N vs EP2SGX60EF1152C3N Vergleich
Detaillierter Direktvergleich von EP2SGX90EF1152C3N von Intel und EP2SGX60EF1152C3N von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | EP2SGX90EF1152C3N | EP2SGX60EF1152C3N |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Aktiv | Obsolete |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $1.280,00 | $2.195,00 |
| Series | Stratix II GX | Stratix II |
| Family | Stratix II GX | Stratix II GX |
| Logic Elements (LE) | 90960 | — |
| Number of LABs/CLBs | 4548 | — |
| Total Memory Bits | 4520448 | — |
| User I/Os | 558 | — |
| Number of Transceivers | [DATA_NEEDED: transceiver count per family] | — |
| Process Technology | 90 nm | 90 nm CMOS |
| Core Voltage | 1.2 V | — |
| Operating Frequency (max) | 816.9 MHz | — |
| Betriebstemperatur | 0C to +85C (Commercial) | 0C to +85C (commercial) |
| Package Type | FC-FBGA (Flip-Chip Fine-pitch BGA) | — |
| Package Pin Count | 1152 balls | — |
| Package Dimensions | 34 mm x 34 mm | — |
| Montageart | Surface Mount | Surface Mount (BGA) |
| Lead-Free / RoHS | Yes (RoHS compliant) | — |
| Speed Grade | EF | C3 (commercial, -3 bin) |
| Temperature Grade | C3 (Commercial) | — |
| Logic Elements | — | 60,440 |
| Adaptive Logic Modules (ALMs) | — | 30,220 |
| Logic Array Blocks (LABs) | — | 3022 |
| Embedded Memory (bits) | — | 2,544,192 |
| Maximum User I/Os | — | 534 |
| Core Voltage (Vcc) | — | 1.2 V |
| Maximum Internal Frequency | — | 717 MHz |
| Propagation Delay | — | 0.40 ns |
| Embedded Multipliers (18x18) | — | [DATA_NEEDED: embedded multiplier count] |
| PLLs | — | 4 |
| Transceiver Data Rate | — | 3.125 Gbps per channel |
| Gehäuse | — | 1152-BBGA (FC-FBGA) 35 x 35 mm, 1.0 mm pitch |