EP2SGX90EF1152C3N vs EP2SGX60EF1152C3N Comparaison
Comparaison détaillée côte à côte de EP2SGX90EF1152C3N par Intel et EP2SGX60EF1152C3N par Intel. Comparez les spécifications clés, les paramètres électriques, le conditionnement, le statut de cycle de vie, les prix et la disponibilité pour déterminer le meilleur composant pour vos exigences de conception.
Comparaison des spécifications
| Paramètre | EP2SGX90EF1152C3N | EP2SGX60EF1152C3N |
|---|---|---|
| Marque | Intel | Intel |
| Catégorie | FPGA & CPLD | FPGA & CPLD |
| Statut du cycle de vie | Actif | Obsolete |
| Statut du stock | In Stock | In Stock |
| Prix unitaire (USD) | $1 280,00 | $2 195,00 |
| Series | Stratix II GX | Stratix II |
| Family | Stratix II GX | Stratix II GX |
| Logic Elements (LE) | 90960 | — |
| Number of LABs/CLBs | 4548 | — |
| Total Memory Bits | 4520448 | — |
| User I/Os | 558 | — |
| Number of Transceivers | [DATA_NEEDED: transceiver count per family] | — |
| Process Technology | 90 nm | 90 nm CMOS |
| Core Voltage | 1.2 V | — |
| Operating Frequency (max) | 816.9 MHz | — |
| Température de fonctionnement | 0C to +85C (Commercial) | 0C to +85C (commercial) |
| Package Type | FC-FBGA (Flip-Chip Fine-pitch BGA) | — |
| Package Pin Count | 1152 balls | — |
| Package Dimensions | 34 mm x 34 mm | — |
| Type de montage | Surface Mount | Surface Mount (BGA) |
| Lead-Free / RoHS | Yes (RoHS compliant) | — |
| Speed Grade | EF | C3 (commercial, -3 bin) |
| Temperature Grade | C3 (Commercial) | — |
| Logic Elements | — | 60,440 |
| Adaptive Logic Modules (ALMs) | — | 30,220 |
| Logic Array Blocks (LABs) | — | 3022 |
| Embedded Memory (bits) | — | 2,544,192 |
| Maximum User I/Os | — | 534 |
| Core Voltage (Vcc) | — | 1.2 V |
| Maximum Internal Frequency | — | 717 MHz |
| Propagation Delay | — | 0.40 ns |
| Embedded Multipliers (18x18) | — | [DATA_NEEDED: embedded multiplier count] |
| PLLs | — | 4 |
| Transceiver Data Rate | — | 3.125 Gbps per channel |
| Boîtier | — | 1152-BBGA (FC-FBGA) 35 x 35 mm, 1.0 mm pitch |