EP2SGX90EF1152C3N vs EP2SGX60EF1152C3N Сравнение
Подробное сравнение бок о бок EP2SGX90EF1152C3N от Intel и EP2SGX60EF1152C3N от Intel. Сравните ключевые характеристики, электрические параметры, упаковку, статус жизненного цикла, цены и наличие, чтобы выбрать лучший компонент для ваших требований.
Сравнение характеристик
| Параметр | EP2SGX90EF1152C3N | EP2SGX60EF1152C3N |
|---|---|---|
| Бренд | Intel | Intel |
| Категория | FPGA & CPLD | FPGA & CPLD |
| Статус жизненного цикла | Активен | Obsolete |
| Наличие | In Stock | In Stock |
| Цена за единицу (USD) | $1.280,00 | $2.195,00 |
| Series | Stratix II GX | Stratix II |
| Family | Stratix II GX | Stratix II GX |
| Logic Elements (LE) | 90960 | — |
| Number of LABs/CLBs | 4548 | — |
| Total Memory Bits | 4520448 | — |
| User I/Os | 558 | — |
| Number of Transceivers | [DATA_NEEDED: transceiver count per family] | — |
| Process Technology | 90 nm | 90 nm CMOS |
| Core Voltage | 1.2 V | — |
| Operating Frequency (max) | 816.9 MHz | — |
| Рабочая температура | 0C to +85C (Commercial) | 0C to +85C (commercial) |
| Package Type | FC-FBGA (Flip-Chip Fine-pitch BGA) | — |
| Package Pin Count | 1152 balls | — |
| Package Dimensions | 34 mm x 34 mm | — |
| Тип монтажа | Surface Mount | Surface Mount (BGA) |
| Lead-Free / RoHS | Yes (RoHS compliant) | — |
| Speed Grade | EF | C3 (commercial, -3 bin) |
| Temperature Grade | C3 (Commercial) | — |
| Logic Elements | — | 60,440 |
| Adaptive Logic Modules (ALMs) | — | 30,220 |
| Logic Array Blocks (LABs) | — | 3022 |
| Embedded Memory (bits) | — | 2,544,192 |
| Maximum User I/Os | — | 534 |
| Core Voltage (Vcc) | — | 1.2 V |
| Maximum Internal Frequency | — | 717 MHz |
| Propagation Delay | — | 0.40 ns |
| Embedded Multipliers (18x18) | — | [DATA_NEEDED: embedded multiplier count] |
| PLLs | — | 4 |
| Transceiver Data Rate | — | 3.125 Gbps per channel |
| Корпус | — | 1152-BBGA (FC-FBGA) 35 x 35 mm, 1.0 mm pitch |