EP2SGX90EF1152C4N vs EP2SGX90EF1152C3N Vergleich
Detaillierter Direktvergleich von EP2SGX90EF1152C4N von Intel und EP2SGX90EF1152C3N von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Intel
EP2SGX90EF1152C4N - Stratix II GX FPGA, 90960 LE, 1152-FBGA | Intel
EP2SGX90EF1152C4N ⚠ Letzte Bestellmöglichkeit
Spezifikationsvergleich
| Parameter | EP2SGX90EF1152C4N | EP2SGX90EF1152C3N |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Letzte Kaufgelegenheit | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $695,00 | $1.280,00 |
| Family | Stratix II GX | Stratix II GX |
| Logic Elements (LE) | 90,960 | 90960 |
| LABs/CLBs | 4,548 | — |
| Total RAM Bits | 4,520,448 bits | — |
| User I/O Count | 558 | — |
| Number of I/O Banks | [DATA_NEEDED: number of I/O banks] | — |
| Core Voltage | 1.2 V | 1.2 V |
| Process Node | 90 nm | — |
| Transceivers | Up to 20 channels, 6.375 Gbps per channel | — |
| Speed Grade | C4 | EF |
| Betriebstemperatur | Commercial (0C to +85C) | 0C to +85C (Commercial) |
| Gehäuse | 1152-BBGA / FC-FBGA-1152 | — |
| Montageart | Surface Mount (BGA) | Surface Mount |
| MSL-Level | MSL-3 / MS-034AAR-1 (per package outline) | — |
| Lead-Free / RoHS | Lead free; RoHS compliance per JEDEC | Yes (RoHS compliant) |
| Series | — | Stratix II GX |
| Number of LABs/CLBs | — | 4548 |
| Total Memory Bits | — | 4520448 |
| User I/Os | — | 558 |
| Number of Transceivers | — | [DATA_NEEDED: transceiver count per family] |
| Process Technology | — | 90 nm |
| Operating Frequency (max) | — | 816.9 MHz |
| Package Type | — | FC-FBGA (Flip-Chip Fine-pitch BGA) |
| Package Pin Count | — | 1152 balls |
| Package Dimensions | — | 34 mm x 34 mm |
| Temperature Grade | — | C3 (Commercial) |