EP2SGX90EF1152C4N vs EP2SGX90EF1152C3N 对比
详细并排对比 EP2SGX90EF1152C4N 出自 Intel 和 EP2SGX90EF1152C3N 出自 Intel。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况，以确定最适合您设计需求的元器件。
Intel
EP2SGX90EF1152C4N - Stratix II GX FPGA, 90960 LE, 1152-FBGA | Intel
EP2SGX90EF1152C4N ⚠ 最后一次采购
规格对比
| 参数 | EP2SGX90EF1152C4N | EP2SGX90EF1152C3N |
|---|---|---|
| 品牌 | Intel | Intel |
| 分类 | FPGA & CPLD | FPGA & CPLD |
| 生命周期状态 | 最后采购期 | 有效 |
| 库存状态 | 有库存 | 有库存 |
| 单价（USD） | $695.00 | $1,280.00 |
| Family | Stratix II GX | Stratix II GX |
| Logic Elements (LE) | 90,960 | 90960 |
| LABs/CLBs | 4,548 | — |
| Total RAM Bits | 4,520,448 bits | — |
| User I/O Count | 558 | — |
| Number of I/O Banks | [DATA_NEEDED: number of I/O banks] | — |
| Core Voltage | 1.2 V | 1.2 V |
| Process Node | 90 nm | — |
| Transceivers | Up to 20 channels, 6.375 Gbps per channel | — |
| Speed Grade | C4 | EF |
| 工作温度 | Commercial (0C to +85C) | 0C to +85C (Commercial) |
| 封装 | 1152-BBGA / FC-FBGA-1152 | — |
| 安装类型 | Surface Mount (BGA) | Surface Mount |
| MSL 等级 | MSL-3 / MS-034AAR-1 (per package outline) | — |
| Lead-Free / RoHS | Lead free; RoHS compliance per JEDEC | Yes (RoHS compliant) |
| Series | — | Stratix II GX |
| Number of LABs/CLBs | — | 4548 |
| Total Memory Bits | — | 4520448 |
| User I/Os | — | 558 |
| Number of Transceivers | — | [DATA_NEEDED: transceiver count per family] |
| Process Technology | — | 90 nm |
| Operating Frequency (max) | — | 816.9 MHz |
| Package Type | — | FC-FBGA (Flip-Chip Fine-pitch BGA) |
| Package Pin Count | — | 1152 balls |
| Package Dimensions | — | 34 mm x 34 mm |
| Temperature Grade | — | C3 (Commercial) |