EP2SGX90EF1152C4N vs EP2SGX90EF1152I3 Vergleich
Detaillierter Direktvergleich von EP2SGX90EF1152C4N von Intel und EP2SGX90EF1152I3 von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Intel
EP2SGX90EF1152C4N - Stratix II GX FPGA, 90960 LE, 1152-FBGA | Intel
EP2SGX90EF1152C4N ⚠ Letzte BestellmöglichkeitIntel
EP2SGX90EF1152I3 - 90,960 LEs, Stratix II GX FPGA | Intel
EP2SGX90EF1152I3 ⚠ Letzte BestellmöglichkeitSpezifikationsvergleich
| Parameter | EP2SGX90EF1152C4N | EP2SGX90EF1152I3 |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Letzte Kaufgelegenheit | Letzte Kaufgelegenheit |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $695,00 | $1.480,00 |
| Family | Stratix II GX | — |
| Logic Elements (LE) | 90,960 | — |
| LABs/CLBs | 4,548 | — |
| Total RAM Bits | 4,520,448 bits | 4,520,448 |
| User I/O Count | 558 | — |
| Number of I/O Banks | [DATA_NEEDED: number of I/O banks] | — |
| Core Voltage | 1.2 V | — |
| Process Node | 90 nm | — |
| Transceivers | Up to 20 channels, 6.375 Gbps per channel | — |
| Speed Grade | C4 | — |
| Betriebstemperatur | Commercial (0C to +85C) | — |
| Gehäuse | 1152-BBGA / FC-FBGA-1152 | — |
| Montageart | Surface Mount (BGA) | Surface Mount |
| MSL-Level | MSL-3 / MS-034AAR-1 (per package outline) | — |
| Lead-Free / RoHS | Lead free; RoHS compliance per JEDEC | — |
| Series | — | Stratix II GX |
| Logic Elements | — | 90,960 |
| Adaptive Logic Modules (ALMs) | — | 558 |
| Equivalent Logic Cells (CLBs) | — | 90,960 |
| Maximum Operating Frequency | — | 622.08 MHz |
| Process Technology | — | 90 nm CMOS |
| Core Supply Voltage (VCCINT) | — | 1.2 V nominal (1.15 V to 1.25 V) |
| Operating Temperature Grade | — | Industrial (-40C to +100C) |
| Package Type | — | 1152-ball FC-FBGA (flip-chip) |
| Terminal Form | — | Ball |
| Terminal Pitch | — | [DATA_NEEDED: ball pitch] |
| Package Code | — | BGA |
| Package Shape | — | Square |
| Configuration Architecture | — | Enhanced Configuration (EPC) devices supported |
| RoHS-Status | — | Compliant |