EP2SGX90EF1152I3 vs EP2SGX90EF1152C3N Vergleich

Detaillierter Direktvergleich von EP2SGX90EF1152I3 von Intel und EP2SGX90EF1152C3N von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.

Intel
EP2SGX90EF1152I3 EP2SGX90EF1152I3 - 90,960 LEs, Stratix II GX FPGA | Intel

EP2SGX90EF1152I3 - 90,960 LEs, Stratix II GX FPGA | Intel

EP2SGX90EF1152I3 ⚠ Letzte Bestellmöglichkeit

Spezifikationsvergleich

Parameter EP2SGX90EF1152I3 EP2SGX90EF1152C3N
Marke Intel Intel
Kategorie FPGA & CPLD FPGA & CPLD
Lebenszyklusstatus Letzte Kaufgelegenheit Aktiv
Lagerstatus In Stock In Stock
Stückpreis (USD) $1.480,00 $1.280,00
Series Stratix II GX Stratix II GX
Logic Elements 90,960 —
Adaptive Logic Modules (ALMs) 558 —
Equivalent Logic Cells (CLBs) 90,960 —
Total RAM Bits 4,520,448 —
Maximum Operating Frequency 622.08 MHz —
Process Technology 90 nm CMOS 90 nm
Core Supply Voltage (VCCINT) 1.2 V nominal (1.15 V to 1.25 V) —
Operating Temperature Grade Industrial (-40C to +100C) —
Package Type 1152-ball FC-FBGA (flip-chip) FC-FBGA (Flip-Chip Fine-pitch BGA)
Terminal Form Ball —
Terminal Pitch [DATA_NEEDED: ball pitch] —
Package Code BGA —
Package Shape Square —
Configuration Architecture Enhanced Configuration (EPC) devices supported —
Montageart Surface Mount Surface Mount
RoHS-Status Compliant —
Family — Stratix II GX
Logic Elements (LE) — 90960
Number of LABs/CLBs — 4548
Total Memory Bits — 4520448
User I/Os — 558
Number of Transceivers — [DATA_NEEDED: transceiver count per family]
Core Voltage — 1.2 V
Operating Frequency (max) — 816.9 MHz
Betriebstemperatur — 0C to +85C (Commercial)
Package Pin Count — 1152 balls
Package Dimensions — 34 mm x 34 mm
Lead-Free / RoHS — Yes (RoHS compliant)
Speed Grade — EF
Temperature Grade — C3 (Commercial)

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