EP2SGX90EF1152I3 vs EP2SGX90EF1152C3N 对比
详细并排对比 EP2SGX90EF1152I3 出自 Intel 和 EP2SGX90EF1152C3N 出自 Intel。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况，以确定最适合您设计需求的元器件。
规格对比
| 参数 | EP2SGX90EF1152I3 | EP2SGX90EF1152C3N |
|---|---|---|
| 品牌 | Intel | Intel |
| 分类 | FPGA & CPLD | FPGA & CPLD |
| 生命周期状态 | 最后采购期 | 有效 |
| 库存状态 | 有库存 | 有库存 |
| 单价（USD） | $1,480.00 | $1,280.00 |
| Series | Stratix II GX | Stratix II GX |
| Logic Elements | 90,960 | — |
| Adaptive Logic Modules (ALMs) | 558 | — |
| Equivalent Logic Cells (CLBs) | 90,960 | — |
| Total RAM Bits | 4,520,448 | — |
| Maximum Operating Frequency | 622.08 MHz | — |
| Process Technology | 90 nm CMOS | 90 nm |
| Core Supply Voltage (VCCINT) | 1.2 V nominal (1.15 V to 1.25 V) | — |
| Operating Temperature Grade | Industrial (-40C to +100C) | — |
| Package Type | 1152-ball FC-FBGA (flip-chip) | FC-FBGA (Flip-Chip Fine-pitch BGA) |
| Terminal Form | Ball | — |
| Terminal Pitch | [DATA_NEEDED: ball pitch] | — |
| Package Code | BGA | — |
| Package Shape | Square | — |
| Configuration Architecture | Enhanced Configuration (EPC) devices supported | — |
| 安装类型 | Surface Mount | Surface Mount |
| RoHS 状态 | Compliant | — |
| Family | — | Stratix II GX |
| Logic Elements (LE) | — | 90960 |
| Number of LABs/CLBs | — | 4548 |
| Total Memory Bits | — | 4520448 |
| User I/Os | — | 558 |
| Number of Transceivers | — | [DATA_NEEDED: transceiver count per family] |
| Core Voltage | — | 1.2 V |
| Operating Frequency (max) | — | 816.9 MHz |
| 工作温度 | — | 0C to +85C (Commercial) |
| Package Pin Count | — | 1152 balls |
| Package Dimensions | — | 34 mm x 34 mm |
| Lead-Free / RoHS | — | Yes (RoHS compliant) |
| Speed Grade | — | EF |
| Temperature Grade | — | C3 (Commercial) |