EP2SGX90EF1152I5N vs EP2SGX60EF1152I5N Vergleich

Detaillierter Direktvergleich von EP2SGX90EF1152I5N von Intel und EP2SGX60EF1152I5N von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.

Spezifikationsvergleich

Parameter EP2SGX90EF1152I5N EP2SGX60EF1152I5N
Marke Intel Intel
Kategorie FPGA & CPLD FPGA & CPLD
Lebenszyklusstatus Obsolete Unknown
Lagerstatus In Stock In Stock
Stückpreis (USD) $1.320,00 $0,00
Family Stratix II GX Stratix II GX
Series EP2SGX90 —
Logic Elements (LEs) 90,960 —
Equivalent CLBs 90,960 —
Process Technology 90 nm CMOS 90 nm CMOS
Core Voltage (VCCINT) 1.2 V —
Maximale Taktfrequenz 609.76 MHz 622.08 MHz
Combinatorial Delay 4.006 ns —
Package Type FC-FBGA (flip-chip fine-pitch BGA) FC-FBGA
Number of Pins/Balls 1152 —
Package Code BGA —
Package Shape SQUARE —
Terminal Form BALL Ball
Operating Temperature Grade INDUSTRIAL (I) —
RoHS-Status [DATA_NEEDED: RoHS status] unknown
Embedded Transceivers Yes (GX series, multi-gigabit PMA) —
On-chip Block Memory [DATA_NEEDED: total M512/M4K/M-RAM bits] —
DSP Blocks [DATA_NEEDED: number of DSP blocks] —
User I/O Banks [DATA_NEEDED: I/O bank count] —
Montageart Surface Mount —
Device Type — Field Programmable Gate Array (FPGA)
Logic Cells — 60,440
Logic Blocks — 60,440
Core Supply Voltage — 1.2 V
Internal Frequency — 717 MHz
Reported Internal Frequency — 609.76 MHz
Betriebstemperaturbereich — -40 °C to 85 °C
Gehäuse — 1152-ball BGA
Package Dimensions — 23 x 23 mm
Terminal Pitch — 1 mm
Number of Terminals — 1152
Temperature Grade — Industrial
Propagation Delay — [DATA_NEEDED: propagation delay]
Configuration Memory — [DATA_NEEDED: configuration memory type and size]
I/O Count — [DATA_NEEDED: user I/O count]
Transceiver Count — [DATA_NEEDED: transceiver count]
REACH Status — unknown

Datenblätter & Ressourcen

Alle Produkte durchsuchen BOM erstellen Angebot anfordern