EP2SGX90EF1152I5N vs EP2SGX60EF1152I5N 对比

详细并排对比 EP2SGX90EF1152I5N 出自 Intel 和 EP2SGX60EF1152I5N 出自 Intel。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况,以确定最适合您设计需求的元器件。

规格对比

参数 EP2SGX90EF1152I5N EP2SGX60EF1152I5N
品牌 Intel Intel
分类 FPGA & CPLD FPGA & CPLD
生命周期状态 Obsolete Unknown
库存状态 有库存 有库存
单价(USD) $1,320.00 $0.00
Family Stratix II GX Stratix II GX
Series EP2SGX90 —
Logic Elements (LEs) 90,960 —
Equivalent CLBs 90,960 —
Process Technology 90 nm CMOS 90 nm CMOS
Core Voltage (VCCINT) 1.2 V —
最大时钟频率 609.76 MHz 622.08 MHz
Combinatorial Delay 4.006 ns —
Package Type FC-FBGA (flip-chip fine-pitch BGA) FC-FBGA
Number of Pins/Balls 1152 —
Package Code BGA —
Package Shape SQUARE —
Terminal Form BALL Ball
Operating Temperature Grade INDUSTRIAL (I) —
RoHS 状态 [DATA_NEEDED: RoHS status] unknown
Embedded Transceivers Yes (GX series, multi-gigabit PMA) —
On-chip Block Memory [DATA_NEEDED: total M512/M4K/M-RAM bits] —
DSP Blocks [DATA_NEEDED: number of DSP blocks] —
User I/O Banks [DATA_NEEDED: I/O bank count] —
安装类型 Surface Mount —
Device Type — Field Programmable Gate Array (FPGA)
Logic Cells — 60,440
Logic Blocks — 60,440
Core Supply Voltage — 1.2 V
Internal Frequency — 717 MHz
Reported Internal Frequency — 609.76 MHz
工作温度范围 — -40 °C to 85 °C
封装 — 1152-ball BGA
Package Dimensions — 23 x 23 mm
Terminal Pitch — 1 mm
Number of Terminals — 1152
Temperature Grade — Industrial
Propagation Delay — [DATA_NEEDED: propagation delay]
Configuration Memory — [DATA_NEEDED: configuration memory type and size]
I/O Count — [DATA_NEEDED: user I/O count]
Transceiver Count — [DATA_NEEDED: transceiver count]
REACH Status — unknown

数据手册与资源

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