EP2SGX90EF1152I5N vs EP2SGX60EF1152I5N Comparação

Comparação detalhada lado a lado de EP2SGX90EF1152I5N por Intel e EP2SGX60EF1152I5N por Intel. Compare especificações principais, parâmetros elétricos, encapsulamento, status do ciclo de vida, preços e disponibilidade para determinar o melhor componente para os requisitos do seu projeto.

Comparação de especificações

Parâmetro EP2SGX90EF1152I5N EP2SGX60EF1152I5N
Marca Intel Intel
Categoria FPGA & CPLD FPGA & CPLD
Status do ciclo de vida Obsolete Unknown
Status do estoque In Stock In Stock
Preço unitário (USD) $1.320,00 $0,00
Family Stratix II GX Stratix II GX
Series EP2SGX90 —
Logic Elements (LEs) 90,960 —
Equivalent CLBs 90,960 —
Process Technology 90 nm CMOS 90 nm CMOS
Core Voltage (VCCINT) 1.2 V —
Frequência máxima de clock 609.76 MHz 622.08 MHz
Combinatorial Delay 4.006 ns —
Package Type FC-FBGA (flip-chip fine-pitch BGA) FC-FBGA
Number of Pins/Balls 1152 —
Package Code BGA —
Package Shape SQUARE —
Terminal Form BALL Ball
Operating Temperature Grade INDUSTRIAL (I) —
Status RoHS [DATA_NEEDED: RoHS status] unknown
Embedded Transceivers Yes (GX series, multi-gigabit PMA) —
On-chip Block Memory [DATA_NEEDED: total M512/M4K/M-RAM bits] —
DSP Blocks [DATA_NEEDED: number of DSP blocks] —
User I/O Banks [DATA_NEEDED: I/O bank count] —
Tipo de montagem Surface Mount —
Device Type — Field Programmable Gate Array (FPGA)
Logic Cells — 60,440
Logic Blocks — 60,440
Core Supply Voltage — 1.2 V
Internal Frequency — 717 MHz
Reported Internal Frequency — 609.76 MHz
Faixa de temperatura de operação — -40 °C to 85 °C
Encapsulamento — 1152-ball BGA
Package Dimensions — 23 x 23 mm
Terminal Pitch — 1 mm
Number of Terminals — 1152
Temperature Grade — Industrial
Propagation Delay — [DATA_NEEDED: propagation delay]
Configuration Memory — [DATA_NEEDED: configuration memory type and size]
I/O Count — [DATA_NEEDED: user I/O count]
Transceiver Count — [DATA_NEEDED: transceiver count]
REACH Status — unknown

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