EP2SGX90FE1152C3 vs EP2SGX90EF1152I3 Vergleich
Detaillierter Direktvergleich von EP2SGX90FE1152C3 von Intel und EP2SGX90EF1152I3 von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Intel
EP2SGX90FE1152C3 - 90K LE Stratix II GX FPGA, 1152-BGA | Intel
EP2SGX90FE1152C3 ⚠ Letzte BestellmöglichkeitIntel
EP2SGX90EF1152I3 - 90,960 LEs, Stratix II GX FPGA | Intel
EP2SGX90EF1152I3 ⚠ Letzte BestellmöglichkeitSpezifikationsvergleich
| Parameter | EP2SGX90FE1152C3 | EP2SGX90EF1152I3 |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Letzte Kaufgelegenheit | Letzte Kaufgelegenheit |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $1.495,00 | $1.480,00 |
| Series | Stratix II GX | Stratix II GX |
| Family Name | Stratix II GX | — |
| Logic Elements / Cells | 90,960 | — |
| Total RAM Bits | 4,520,448 | 4,520,448 |
| Number of LABs / CLBs | 4,548 | — |
| Number of Logic Elements / Cells | 90,960 | — |
| Number of I/O | 558 | — |
| Number of Gates | [DATA_NEEDED: gates count] | — |
| Voltage - Supply | 1.2 V core | — |
| Betriebstemperatur | 0C to +85C (commercial, C3 suffix) | — |
| Montageart | Surface Mount (BGA) | Surface Mount |
| Gehäuse / Bauform | 1152-BBGA / FC-FBGA | — |
| Process Technology | 90 nm CMOS | 90 nm CMOS |
| Transceiver Data Rate (max) | 6.375 Gbps | — |
| Number of Transceiver Channels | 12 | — |
| DSP Blocks (18x18 multipliers) | 192 | — |
| Configuration Support | PS, PPS, PPA, FPP, JTAG | — |
| RoHS-Status | [DATA_NEEDED: RoHS status] | Compliant |
| Feuchtigkeitsempfindlichkeitsgrad (MSL) | [DATA_NEEDED: MSL level] | — |
| Logic Elements | — | 90,960 |
| Adaptive Logic Modules (ALMs) | — | 558 |
| Equivalent Logic Cells (CLBs) | — | 90,960 |
| Maximum Operating Frequency | — | 622.08 MHz |
| Core Supply Voltage (VCCINT) | — | 1.2 V nominal (1.15 V to 1.25 V) |
| Operating Temperature Grade | — | Industrial (-40C to +100C) |
| Package Type | — | 1152-ball FC-FBGA (flip-chip) |
| Terminal Form | — | Ball |
| Terminal Pitch | — | [DATA_NEEDED: ball pitch] |
| Package Code | — | BGA |
| Package Shape | — | Square |
| Configuration Architecture | — | Enhanced Configuration (EPC) devices supported |