EP2SGX90FE1152C3 vs EP2SGX90EF1152I3 Comparación
Comparación detallada lado a lado de EP2SGX90FE1152C3 por Intel y EP2SGX90EF1152I3 por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Intel
EP2SGX90FE1152C3 - 90K LE Stratix II GX FPGA, 1152-BGA | Intel
EP2SGX90FE1152C3 ⚠ Última compra
Comparación de especificaciones
| Parámetro | EP2SGX90FE1152C3 | EP2SGX90EF1152I3 |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Última compra | Última compra |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $1.495,00 | $1.480,00 |
| Series | Stratix II GX | Stratix II GX |
| Family Name | Stratix II GX | — |
| Logic Elements / Cells | 90,960 | — |
| Total RAM Bits | 4,520,448 | 4,520,448 |
| Number of LABs / CLBs | 4,548 | — |
| Number of Logic Elements / Cells | 90,960 | — |
| Number of I/O | 558 | — |
| Number of Gates | [DATA_NEEDED: gates count] | — |
| Voltage - Supply | 1.2 V core | — |
| Temperatura de funcionamiento | 0C to +85C (commercial, C3 suffix) | — |
| Tipo de montaje | Surface Mount (BGA) | Surface Mount |
| Encapsulado / Carcasa | 1152-BBGA / FC-FBGA | — |
| Process Technology | 90 nm CMOS | 90 nm CMOS |
| Transceiver Data Rate (max) | 6.375 Gbps | — |
| Number of Transceiver Channels | 12 | — |
| DSP Blocks (18x18 multipliers) | 192 | — |
| Configuration Support | PS, PPS, PPA, FPP, JTAG | — |
| Estado RoHS | [DATA_NEEDED: RoHS status] | Compliant |
| Nivel de sensibilidad a la humedad (MSL) | [DATA_NEEDED: MSL level] | — |
| Logic Elements | — | 90,960 |
| Adaptive Logic Modules (ALMs) | — | 558 |
| Equivalent Logic Cells (CLBs) | — | 90,960 |
| Maximum Operating Frequency | — | 622.08 MHz |
| Core Supply Voltage (VCCINT) | — | 1.2 V nominal (1.15 V to 1.25 V) |
| Operating Temperature Grade | — | Industrial (-40C to +100C) |
| Package Type | — | 1152-ball FC-FBGA (flip-chip) |
| Terminal Form | — | Ball |
| Terminal Pitch | — | [DATA_NEEDED: ball pitch] |
| Package Code | — | BGA |
| Package Shape | — | Square |
| Configuration Architecture | — | Enhanced Configuration (EPC) devices supported |