EP2SGX90FE1152C3 vs EP2SGX90EF1152I3 Comparaison
Comparaison détaillée côte à côte de EP2SGX90FE1152C3 par Intel et EP2SGX90EF1152I3 par Intel. Comparez les spécifications clés, les paramètres électriques, le conditionnement, le statut de cycle de vie, les prix et la disponibilité pour déterminer le meilleur composant pour vos exigences de conception.
Intel
EP2SGX90FE1152C3 - 90K LE Stratix II GX FPGA, 1152-BGA | Intel
EP2SGX90FE1152C3 ⚠ Dernier achat
Comparaison des spécifications
| Paramètre | EP2SGX90FE1152C3 | EP2SGX90EF1152I3 |
|---|---|---|
| Marque | Intel | Intel |
| Catégorie | FPGA & CPLD | FPGA & CPLD |
| Statut du cycle de vie | Dernier achat | Dernier achat |
| Statut du stock | In Stock | In Stock |
| Prix unitaire (USD) | $1 495,00 | $1 480,00 |
| Series | Stratix II GX | Stratix II GX |
| Family Name | Stratix II GX | — |
| Logic Elements / Cells | 90,960 | — |
| Total RAM Bits | 4,520,448 | 4,520,448 |
| Number of LABs / CLBs | 4,548 | — |
| Number of Logic Elements / Cells | 90,960 | — |
| Number of I/O | 558 | — |
| Number of Gates | [DATA_NEEDED: gates count] | — |
| Voltage - Supply | 1.2 V core | — |
| Température de fonctionnement | 0C to +85C (commercial, C3 suffix) | — |
| Type de montage | Surface Mount (BGA) | Surface Mount |
| Boîtier / Format | 1152-BBGA / FC-FBGA | — |
| Process Technology | 90 nm CMOS | 90 nm CMOS |
| Transceiver Data Rate (max) | 6.375 Gbps | — |
| Number of Transceiver Channels | 12 | — |
| DSP Blocks (18x18 multipliers) | 192 | — |
| Configuration Support | PS, PPS, PPA, FPP, JTAG | — |
| Statut RoHS | [DATA_NEEDED: RoHS status] | Compliant |
| Niveau de sensibilité à l'humidité (MSL) | [DATA_NEEDED: MSL level] | — |
| Logic Elements | — | 90,960 |
| Adaptive Logic Modules (ALMs) | — | 558 |
| Equivalent Logic Cells (CLBs) | — | 90,960 |
| Maximum Operating Frequency | — | 622.08 MHz |
| Core Supply Voltage (VCCINT) | — | 1.2 V nominal (1.15 V to 1.25 V) |
| Operating Temperature Grade | — | Industrial (-40C to +100C) |
| Package Type | — | 1152-ball FC-FBGA (flip-chip) |
| Terminal Form | — | Ball |
| Terminal Pitch | — | [DATA_NEEDED: ball pitch] |
| Package Code | — | BGA |
| Package Shape | — | Square |
| Configuration Architecture | — | Enhanced Configuration (EPC) devices supported |