EP2SGX90FF1508C3 vs EP2SGX90FF1508C3ES Vergleich

Detaillierter Direktvergleich von EP2SGX90FF1508C3 von Intel und EP2SGX90FF1508C3ES von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.

Spezifikationsvergleich

Parameter EP2SGX90FF1508C3 EP2SGX90FF1508C3ES
Marke Intel Intel
Kategorie FPGA & CPLD FPGA & CPLD
Lebenszyklusstatus Obsolete Obsolete
Lagerstatus In Stock In Stock
Stückpreis (USD) $1.380,00 $1.340,00
Family Stratix II GX Stratix II GX
Logic Elements 90,960 90,960
LABs / CLBs 4,548 —
Total Memory Bits 4,520,448 —
Maximum User I/O 650 —
Number of Transceivers 4 (per family datasheet) —
Core Voltage 1.2 V —
Betriebstemperatur 0C to +85C (commercial) —
Speed Grade -3 —
Process Technology 90 nm CMOS 90 nm CMOS
Package Type 1508-ball FC-FBGA (FBGA-1508) —
Package Dimensions 40 x 40 mm —
Ball Pitch 1.0 mm —
Montageart Surface Mount (Tray) Surface Mount
RoHS-Status Compliant [DATA_NEEDED: rohs]
Configuration Method SRAM-based, JTAG / Passive / Active serial —
Logic Array Blocks (LABs) — 4,828
Embedded Memory (TriMatrix) — 4,520,448 bits
Total RAM Bits — 4,520,448
Core Supply Voltage — 1.2 V
Maximum Internal Frequency — 816.9 MHz
DSP Blocks — Yes (dedicated multiplier blocks)
Embedded Transceivers — Up to 3.125 Gbps multi-gigabit transceivers
Global Clock Networks — Up to 16
Regional Clock Networks — Up to 32 per device region
Gehäuse — 1508-ball FC-FBGA (Flip-Chip FineLine BGA), 1.00 mm pitch
Configuration Interface — JTAG / EPCS serial flash / Passive parallel
Operating Temperature Grade — Commercial / Industrial (per part suffix)

Datenblätter & Ressourcen

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