EP2SGX90FF1508C3 vs EP2SGX90FF1508C3ES Comparación
Comparación detallada lado a lado de EP2SGX90FF1508C3 por Intel y EP2SGX90FF1508C3ES por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Intel
EP2SGX90FF1508C3 - Stratix II GX FPGA, 90K LEs, FC-FBGA-1508 | Intel
EP2SGX90FF1508C3 ObsoleteIntel
EP2SGX90FF1508C3ES - 90K LE Stratix II GX FPGA, 1508-FCBGA | Intel
EP2SGX90FF1508C3ES ObsoleteComparación de especificaciones
| Parámetro | EP2SGX90FF1508C3 | EP2SGX90FF1508C3ES |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Obsolete | Obsolete |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $1.380,00 | $1.340,00 |
| Family | Stratix II GX | Stratix II GX |
| Logic Elements | 90,960 | 90,960 |
| LABs / CLBs | 4,548 | — |
| Total Memory Bits | 4,520,448 | — |
| Maximum User I/O | 650 | — |
| Number of Transceivers | 4 (per family datasheet) | — |
| Core Voltage | 1.2 V | — |
| Temperatura de funcionamiento | 0C to +85C (commercial) | — |
| Speed Grade | -3 | — |
| Process Technology | 90 nm CMOS | 90 nm CMOS |
| Package Type | 1508-ball FC-FBGA (FBGA-1508) | — |
| Package Dimensions | 40 x 40 mm | — |
| Ball Pitch | 1.0 mm | — |
| Tipo de montaje | Surface Mount (Tray) | Surface Mount |
| Estado RoHS | Compliant | [DATA_NEEDED: rohs] |
| Configuration Method | SRAM-based, JTAG / Passive / Active serial | — |
| Logic Array Blocks (LABs) | — | 4,828 |
| Embedded Memory (TriMatrix) | — | 4,520,448 bits |
| Total RAM Bits | — | 4,520,448 |
| Core Supply Voltage | — | 1.2 V |
| Maximum Internal Frequency | — | 816.9 MHz |
| DSP Blocks | — | Yes (dedicated multiplier blocks) |
| Embedded Transceivers | — | Up to 3.125 Gbps multi-gigabit transceivers |
| Global Clock Networks | — | Up to 16 |
| Regional Clock Networks | — | Up to 32 per device region |
| Encapsulado | — | 1508-ball FC-FBGA (Flip-Chip FineLine BGA), 1.00 mm pitch |
| Configuration Interface | — | JTAG / EPCS serial flash / Passive parallel |
| Operating Temperature Grade | — | Commercial / Industrial (per part suffix) |