EP2SGX90FF1508C3ES vs EP2SGX90FF1508C3 Vergleich
Detaillierter Direktvergleich von EP2SGX90FF1508C3ES von Intel und EP2SGX90FF1508C3 von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Intel
EP2SGX90FF1508C3ES - 90K LE Stratix II GX FPGA, 1508-FCBGA | Intel
EP2SGX90FF1508C3ES ObsoleteIntel
EP2SGX90FF1508C3 - Stratix II GX FPGA, 90K LEs, FC-FBGA-1508 | Intel
EP2SGX90FF1508C3 ObsoleteSpezifikationsvergleich
| Parameter | EP2SGX90FF1508C3ES | EP2SGX90FF1508C3 |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Obsolete | Obsolete |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $1.340,00 | $1.380,00 |
| Family | Stratix II GX | Stratix II GX |
| Logic Elements | 90,960 | 90,960 |
| Logic Array Blocks (LABs) | 4,828 | — |
| Embedded Memory (TriMatrix) | 4,520,448 bits | — |
| Total RAM Bits | 4,520,448 | — |
| Process Technology | 90 nm CMOS | 90 nm CMOS |
| Core Supply Voltage | 1.2 V | — |
| Maximum Internal Frequency | 816.9 MHz | — |
| DSP Blocks | Yes (dedicated multiplier blocks) | — |
| Embedded Transceivers | Up to 3.125 Gbps multi-gigabit transceivers | — |
| Global Clock Networks | Up to 16 | — |
| Regional Clock Networks | Up to 32 per device region | — |
| Gehäuse | 1508-ball FC-FBGA (Flip-Chip FineLine BGA), 1.00 mm pitch | — |
| Montageart | Surface Mount | Surface Mount (Tray) |
| Configuration Interface | JTAG / EPCS serial flash / Passive parallel | — |
| Operating Temperature Grade | Commercial / Industrial (per part suffix) | — |
| RoHS-Status | [DATA_NEEDED: rohs] | Compliant |
| LABs / CLBs | — | 4,548 |
| Total Memory Bits | — | 4,520,448 |
| Maximum User I/O | — | 650 |
| Number of Transceivers | — | 4 (per family datasheet) |
| Core Voltage | — | 1.2 V |
| Betriebstemperatur | — | 0C to +85C (commercial) |
| Speed Grade | — | -3 |
| Package Type | — | 1508-ball FC-FBGA (FBGA-1508) |
| Package Dimensions | — | 40 x 40 mm |
| Ball Pitch | — | 1.0 mm |
| Configuration Method | — | SRAM-based, JTAG / Passive / Active serial |