EP3C10E144C7N vs EP3C10F256C6 Vergleich
Detaillierter Direktvergleich von EP3C10E144C7N von Intel und EP3C10F256C6 von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | EP3C10E144C7N | EP3C10F256C6 |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Aktiv | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $45,20 | $36,75 |
| Family | Cyclone® III | Cyclone III |
| Manufacturer | Intel (formerly Altera) | — |
| Logic Elements (LEs) | 10,320 | — |
| Embedded Memory (M9K BRAM) | 414 Kbits | — |
| Embedded 18x18 Multipliers | 23 | 23 |
| Maximum User I/Os | 94 | 182 |
| PLLs | 4 | 2 |
| Core Voltage (VCCINT) | 1.15 V to 1.25 V | 1.15 V to 1.25 V (typ. 1.2 V) |
| Maximum Internal Clock Frequency | 437.5 MHz | — |
| Gehäuse | 144-pin LQFP Exposed Pad (EQFP-144) | 256-FBGA (FineLine BGA, 17x17 mm, 1.0 mm pitch) |
| Process Technology | TSMC 65 nm low-power CMOS | 60 nm low-power CMOS |
| Configuration Modes | JTAG, Active Serial, Active Parallel | — |
| Betriebs-Sperrschichttemperatur | 0C to +85C (Commercial, C7 speed grade) | — |
| I/O Standards Supported | LVDS, LVCMOS, SSTL, HSTL (per bank VCCIO) | — |
| RoHS-Status | Compliant | Compliant (lead-free FBGA) |
| Logic Elements (LE) | — | 10,320 |
| Total Memory Bits | — | 423,936 bits |
| Montageart | — | Surface Mount (BGA) |
| I/O Voltage (VCCIO) | — | 1.2 V to 3.3 V (bank-dependent) |
| Configuration Memory | — | SRAM-based (external EPCS flash required) |
| Betriebstemperatur | — | -40 C to +125 C (industrial, suffix 'C') |
| Speed Grade | — | 6 |
| MSL-Level | — | 3 (168 hours) |