EP3C10E144C7N vs EP3C10F256C6 Comparison
Detailed side-by-side comparison of EP3C10E144C7N by Intel and EP3C10F256C6 by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Specification Comparison
| Parameter | EP3C10E144C7N | EP3C10F256C6 |
|---|---|---|
| Brand | Intel | Intel |
| Category | FPGA & CPLD | FPGA & CPLD |
| Lifecycle Status | Active | Active |
| Stock Status | In Stock | In Stock |
| Unit Price (USD) | $45.20 | $36.75 |
| Family | Cycloneยฎ III | Cyclone III |
| Manufacturer | Intel (formerly Altera) | โ |
| Logic Elements (LEs) | 10,320 | โ |
| Embedded Memory (M9K BRAM) | 414 Kbits | โ |
| Embedded 18x18 Multipliers | 23 | 23 |
| Maximum User I/Os | 94 | 182 |
| PLLs | 4 | 2 |
| Core Voltage (VCCINT) | 1.15 V to 1.25 V | 1.15 V to 1.25 V (typ. 1.2 V) |
| Maximum Internal Clock Frequency | 437.5 MHz | โ |
| Package | 144-pin LQFP Exposed Pad (EQFP-144) | 256-FBGA (FineLine BGA, 17x17 mm, 1.0 mm pitch) |
| Process Technology | TSMC 65 nm low-power CMOS | 60 nm low-power CMOS |
| Configuration Modes | JTAG, Active Serial, Active Parallel | โ |
| Operating Junction Temperature | 0C to +85C (Commercial, C7 speed grade) | โ |
| I/O Standards Supported | LVDS, LVCMOS, SSTL, HSTL (per bank VCCIO) | โ |
| RoHS Status | Compliant | Compliant (lead-free FBGA) |
| Logic Elements (LE) | โ | 10,320 |
| Total Memory Bits | โ | 423,936 bits |
| Mounting Type | โ | Surface Mount (BGA) |
| I/O Voltage (VCCIO) | โ | 1.2 V to 3.3 V (bank-dependent) |
| Configuration Memory | โ | SRAM-based (external EPCS flash required) |
| Operating Temperature | โ | -40 C to +125 C (industrial, suffix 'C') |
| Speed Grade | โ | 6 |
| MSL Level | โ | 3 (168 hours) |