EP3C10E144C7N vs EP3C10F256C6 对比
详细并排对比 EP3C10E144C7N 出自 Intel 和 EP3C10F256C6 出自 Intel。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况，以确定最适合您设计需求的元器件。
规格对比
| 参数 | EP3C10E144C7N | EP3C10F256C6 |
|---|---|---|
| 品牌 | Intel | Intel |
| 分类 | FPGA & CPLD | FPGA & CPLD |
| 生命周期状态 | 有效 | 有效 |
| 库存状态 | 有库存 | 有库存 |
| 单价（USD） | $45.20 | $36.75 |
| Family | Cyclone® III | Cyclone III |
| Manufacturer | Intel (formerly Altera) | — |
| Logic Elements (LEs) | 10,320 | — |
| Embedded Memory (M9K BRAM) | 414 Kbits | — |
| Embedded 18x18 Multipliers | 23 | 23 |
| Maximum User I/Os | 94 | 182 |
| PLLs | 4 | 2 |
| Core Voltage (VCCINT) | 1.15 V to 1.25 V | 1.15 V to 1.25 V (typ. 1.2 V) |
| Maximum Internal Clock Frequency | 437.5 MHz | — |
| 封装 | 144-pin LQFP Exposed Pad (EQFP-144) | 256-FBGA (FineLine BGA, 17x17 mm, 1.0 mm pitch) |
| Process Technology | TSMC 65 nm low-power CMOS | 60 nm low-power CMOS |
| Configuration Modes | JTAG, Active Serial, Active Parallel | — |
| 工作结温 | 0C to +85C (Commercial, C7 speed grade) | — |
| I/O Standards Supported | LVDS, LVCMOS, SSTL, HSTL (per bank VCCIO) | — |
| RoHS 状态 | Compliant | Compliant (lead-free FBGA) |
| Logic Elements (LE) | — | 10,320 |
| Total Memory Bits | — | 423,936 bits |
| 安装类型 | — | Surface Mount (BGA) |
| I/O Voltage (VCCIO) | — | 1.2 V to 3.3 V (bank-dependent) |
| Configuration Memory | — | SRAM-based (external EPCS flash required) |
| 工作温度 | — | -40 C to +125 C (industrial, suffix 'C') |
| Speed Grade | — | 6 |
| MSL 等级 | — | 3 (168 hours) |