EP3C120F780C7N vs EP3C40F780C6N Vergleich
Detaillierter Direktvergleich von EP3C120F780C7N von Intel und EP3C40F780C6N von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | EP3C120F780C7N | EP3C40F780C6N |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Aktiv | NRND |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $162,00 | $172,00 |
| Family | Cyclone III | Cyclone III |
| Series | EP3C120 | — |
| Logic Elements (LE) | 119,088 | — |
| Total Memory Bits | 3,981,312 | — |
| Embedded Memory Blocks (M9K) | 432 | — |
| 18x18 Hardware Multipliers | 531 | — |
| PLLs | 4 | 4 |
| Global Clock Networks | 20 | — |
| Maximum User I/O | 429 | — |
| Betriebstemperatur | 0C to +85C (commercial) | 0C to +85C (commercial) |
| Core Voltage (VCCINT) | 1.2 V | — |
| Speed Grade | C7 | 6 (commercial) |
| Process Technology | 65 nm low-k | 60 nm CMOS |
| Gehäuse | 780-pin FBGA (F780) | 780-ball FBGA (FineLine BGA) |
| Montageart | Surface Mount (BGA) | Surface Mount (FBGA) |
| Lead-Free / RoHS | Yes (suffix N) | — |
| Configuration Modes | AS, AP, FPP, PS, JTAG | — |
| Logic Elements | — | 39,600 |
| Embedded Memory Bits | — | 1,161,216 |
| Embedded Memory (Kbytes) | — | 113 |
| M9K Memory Blocks | — | 126 |
| Logic Array Blocks (LABs) | — | 4,065 |
| Maximum User I/O Pins | — | 535 |
| Core Voltage | — | 1.2 V |
| Package Dimensions | — | 29 x 29 mm |
| Ball Pitch | — | 1.0 mm |
| Package Height | — | 2.6 mm |
| Lead Free | — | Yes |
| Configuration Method | — | SRAM, JTAG via USB-Blaster |
| RoHS-Status | — | Compliant |