EP3C120F780C7N vs EP3C40F780C6N Comparación
Comparación detallada lado a lado de EP3C120F780C7N por Intel y EP3C40F780C6N por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | EP3C120F780C7N | EP3C40F780C6N |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Activo | NRND |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $162,00 | $172,00 |
| Family | Cyclone III | Cyclone III |
| Series | EP3C120 | — |
| Logic Elements (LE) | 119,088 | — |
| Total Memory Bits | 3,981,312 | — |
| Embedded Memory Blocks (M9K) | 432 | — |
| 18x18 Hardware Multipliers | 531 | — |
| PLLs | 4 | 4 |
| Global Clock Networks | 20 | — |
| Maximum User I/O | 429 | — |
| Temperatura de funcionamiento | 0C to +85C (commercial) | 0C to +85C (commercial) |
| Core Voltage (VCCINT) | 1.2 V | — |
| Speed Grade | C7 | 6 (commercial) |
| Process Technology | 65 nm low-k | 60 nm CMOS |
| Encapsulado | 780-pin FBGA (F780) | 780-ball FBGA (FineLine BGA) |
| Tipo de montaje | Surface Mount (BGA) | Surface Mount (FBGA) |
| Lead-Free / RoHS | Yes (suffix N) | — |
| Configuration Modes | AS, AP, FPP, PS, JTAG | — |
| Logic Elements | — | 39,600 |
| Embedded Memory Bits | — | 1,161,216 |
| Embedded Memory (Kbytes) | — | 113 |
| M9K Memory Blocks | — | 126 |
| Logic Array Blocks (LABs) | — | 4,065 |
| Maximum User I/O Pins | — | 535 |
| Core Voltage | — | 1.2 V |
| Package Dimensions | — | 29 x 29 mm |
| Ball Pitch | — | 1.0 mm |
| Package Height | — | 2.6 mm |
| Lead Free | — | Yes |
| Configuration Method | — | SRAM, JTAG via USB-Blaster |
| Estado RoHS | — | Compliant |