EP3C16F256C7 vs EP3C16F256I7N Vergleich
Detaillierter Direktvergleich von EP3C16F256C7 von Intel und EP3C16F256I7N von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | EP3C16F256C7 | EP3C16F256I7N |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Aktiv | Aktiv |
| Device Type | FPGA (Field Programmable Gate Array) | — |
| Device Family | Cyclone III | — |
| Logic Cells / Logic Blocks | 15,408 | — |
| Embedded Memory | 516,096 bit | 56 M9K blocks (504 Kbit) |
| User I/O | 168 | — |
| Total Package Pins | 256 | — |
| Package Type | 256-LBGA (FBGA-256) | — |
| Package Type Designation | Other, LEAD FREE, MS-034, FBGA-256 | — |
| Montageart | Surface mount | — |
| Betriebstemperatur | -40 °C to +125 °C (-40 °F to +257 °F) | -40C to +100C (industrial, I7) |
| Lead-Free Status | Lead free | — |
| Minimum Operating Supply Voltage | [DATA_NEEDED: minimum operating supply voltage] | — |
| Maximum Operating Supply Voltage | [DATA_NEEDED: maximum operating supply voltage] | — |
| Core Performance | [DATA_NEEDED: core performance rating or maximum operating frequency] | — |
| Embedded Memory Block Count | [DATA_NEEDED: embedded memory block count] | — |
| Internal Block RAM Capacity | 516,096 bit | — |
| PLL Count | [DATA_NEEDED: PLL count] | — |
| Dedicated Multipliers | [DATA_NEEDED: dedicated multiplier count] | — |
| RoHS Compliance | [DATA_NEEDED: RoHS compliance statement] | Compliant |
| REACH Compliance | [DATA_NEEDED: REACH compliance statement] | — |
| AEC-Q100 Qualification | [DATA_NEEDED: AEC-Q100 qualification status] | — |
| Family | — | Cyclone III |
| Logic Elements (LEs) | — | 15408 |
| Logic Array Blocks (LABs) | — | 963 |
| Total Memory Bits | — | 516096 |
| Embedded 18x18 Multipliers | — | 56 |
| PLLs | — | 4 |
| Maximum User I/O Pins | — | 168 |
| Gehäuse | — | 256-ball FBGA (17 mm x 17 mm, 1.0 mm pitch) |
| Supply Voltage (Core) | — | 1.2 V typical |
| Process Technology | — | TSMC 60 nm low-leakage |
| Configuration | — | SRAM-based, requires external config device (EPCS/EPCQ) |
| Lead-Free / Pb-Free | — | Yes (N suffix per JEDEC JESD97) |