EP3C16F256C7 vs EP3C16F256I7N 对比

详细并排对比 EP3C16F256C7 出自 Intel 和 EP3C16F256I7N 出自 Intel。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况,以确定最适合您设计需求的元器件。

规格对比

参数 EP3C16F256C7 EP3C16F256I7N
品牌 Intel Intel
分类 FPGA & CPLD FPGA & CPLD
生命周期状态 有效 有效
Device Type FPGA (Field Programmable Gate Array) —
Device Family Cyclone III —
Logic Cells / Logic Blocks 15,408 —
Embedded Memory 516,096 bit 56 M9K blocks (504 Kbit)
User I/O 168 —
Total Package Pins 256 —
Package Type 256-LBGA (FBGA-256) —
Package Type Designation Other, LEAD FREE, MS-034, FBGA-256 —
安装类型 Surface mount —
工作温度 -40 °C to +125 °C (-40 °F to +257 °F) -40C to +100C (industrial, I7)
Lead-Free Status Lead free —
Minimum Operating Supply Voltage [DATA_NEEDED: minimum operating supply voltage] —
Maximum Operating Supply Voltage [DATA_NEEDED: maximum operating supply voltage] —
Core Performance [DATA_NEEDED: core performance rating or maximum operating frequency] —
Embedded Memory Block Count [DATA_NEEDED: embedded memory block count] —
Internal Block RAM Capacity 516,096 bit —
PLL Count [DATA_NEEDED: PLL count] —
Dedicated Multipliers [DATA_NEEDED: dedicated multiplier count] —
RoHS Compliance [DATA_NEEDED: RoHS compliance statement] Compliant
REACH Compliance [DATA_NEEDED: REACH compliance statement] —
AEC-Q100 Qualification [DATA_NEEDED: AEC-Q100 qualification status] —
Family — Cyclone III
Logic Elements (LEs) — 15408
Logic Array Blocks (LABs) — 963
Total Memory Bits — 516096
Embedded 18x18 Multipliers — 56
PLLs — 4
Maximum User I/O Pins — 168
封装 — 256-ball FBGA (17 mm x 17 mm, 1.0 mm pitch)
Supply Voltage (Core) — 1.2 V typical
Process Technology — TSMC 60 nm low-leakage
Configuration — SRAM-based, requires external config device (EPCS/EPCQ)
Lead-Free / Pb-Free — Yes (N suffix per JEDEC JESD97)

数据手册与资源

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