EP3C16F484C6N vs EP3C16F484I7 Vergleich
Detaillierter Direktvergleich von EP3C16F484C6N von Intel und EP3C16F484I7 von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | EP3C16F484C6N | EP3C16F484I7 |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Aktiv | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $338,75 | $58,10 |
| Series | Cyclone III | — |
| Family | Cyclone III | Cyclone III |
| Logic Elements (LE) | 15,408 | — |
| Adaptive Logic Modules (ALMs) | 963 ALMs | — |
| Embedded Memory | 516,096 bits (504 Kbits) | — |
| Embedded 18x18 Multipliers | 56 | 56 |
| User I/O Pins (max) | 346 | — |
| PLLs | 4 | — |
| Global Clock Networks | 20 | — |
| Core Supply Voltage | 1.15 V to 1.25 V | — |
| Operating Temperature (Commercial) | 0 C to 85 C | — |
| Speed Grade | -6 | 7 (fastest commercial/industrial) |
| Gehäuse | 484-ball FineLine BGA (FBGA) | 484-ball FineLine BGA (F484) |
| Ball Pitch | 1.0 mm | — |
| Process Technology | 65 nm TSMC | — |
| Configuration Modes | JTAG, Passive Serial, Fast Passive Parallel | — |
| Montageart | Surface Mount | Surface Mount |
| RoHS-Status | Compliant (lead-free, N suffix) | Compliant |
| Manufacturer | — | Intel (formerly Altera) |
| Logic Elements | — | 15,408 |
| Logic Array Blocks (LABs) | — | 963 |
| Total Embedded Memory | — | 516,096 bits (63 KB) |
| Embedded Memory Blocks | — | M9K x 56 |
| User I/Os | — | 346 |
| General-Purpose PLLs | — | 4 |
| Betriebstemperatur | — | -40C to +100C (industrial) |
| Process Node | — | 60 nm TSMC low-power |
| Configuration Method | — | Passive Serial, Fast Passive Parallel, Active Serial, JTAG |