EP3C16F484C6N vs EP3C16F484I7 Comparación
Comparación detallada lado a lado de EP3C16F484C6N por Intel y EP3C16F484I7 por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | EP3C16F484C6N | EP3C16F484I7 |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Activo | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $338,75 | $58,10 |
| Series | Cyclone III | — |
| Family | Cyclone III | Cyclone III |
| Logic Elements (LE) | 15,408 | — |
| Adaptive Logic Modules (ALMs) | 963 ALMs | — |
| Embedded Memory | 516,096 bits (504 Kbits) | — |
| Embedded 18x18 Multipliers | 56 | 56 |
| User I/O Pins (max) | 346 | — |
| PLLs | 4 | — |
| Global Clock Networks | 20 | — |
| Core Supply Voltage | 1.15 V to 1.25 V | — |
| Operating Temperature (Commercial) | 0 C to 85 C | — |
| Speed Grade | -6 | 7 (fastest commercial/industrial) |
| Encapsulado | 484-ball FineLine BGA (FBGA) | 484-ball FineLine BGA (F484) |
| Ball Pitch | 1.0 mm | — |
| Process Technology | 65 nm TSMC | — |
| Configuration Modes | JTAG, Passive Serial, Fast Passive Parallel | — |
| Tipo de montaje | Surface Mount | Surface Mount |
| Estado RoHS | Compliant (lead-free, N suffix) | Compliant |
| Manufacturer | — | Intel (formerly Altera) |
| Logic Elements | — | 15,408 |
| Logic Array Blocks (LABs) | — | 963 |
| Total Embedded Memory | — | 516,096 bits (63 KB) |
| Embedded Memory Blocks | — | M9K x 56 |
| User I/Os | — | 346 |
| General-Purpose PLLs | — | 4 |
| Temperatura de funcionamiento | — | -40C to +100C (industrial) |
| Process Node | — | 60 nm TSMC low-power |
| Configuration Method | — | Passive Serial, Fast Passive Parallel, Active Serial, JTAG |