EP3C16F484C7N vs EP3C16F484C8 Vergleich

Detaillierter Direktvergleich von EP3C16F484C7N von Intel und EP3C16F484C8 von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.

Spezifikationsvergleich

Parameter EP3C16F484C7N EP3C16F484C8
Marke Intel Intel
Kategorie FPGA & CPLD FPGA & CPLD
Lebenszyklusstatus Aktiv Aktiv
Device Family Cyclone III —
Logic Elements 15,408 15,408 logic elements
Embedded Memory 504 Kbits (M9K blocks) —
Embedded Multipliers 56 (18x18) —
PLLs 4 —
User I/O Pins 346 —
Process Technology 65 nm TSMC low-power —
Core Voltage 1.2 V (1.15 V to 1.25 V) —
Gehäuse 484-ball FBGA 484-pin FBGA
Speed Grade -7 —
Betriebstemperatur 0C to +85C (commercial) —
Maximum Internal Frequency 437.5 MHz —
I/O Standards Supported LVDS, LVCMOS, LVTTL, SSTL, HSTL —
Configuration Method JTAG (IEEE 1149.1), EPCS serial flash, Active Serial [DATA_NEEDED: configuration methods]
RoHS-Status Compliant —
Device Type — Field Programmable Gate Array (FPGA)
FPGA Family — Cyclone III
Programmable Logic Bits — 516,096 bits
I/O Count — 346 I/O
Versorgungsspannung — 1.2 V
Terminal Count — 484 terminals
Terminal Form — Ball
Package Shape — Rectangular
Montageart — Surface Mount
Minimum Operating Temperature — [DATA_NEEDED: minimum operating temperature]
Maximum Operating Temperature — [DATA_NEEDED: maximum operating temperature]
Core Frequency — [DATA_NEEDED: maximum core frequency]
I/O Standard — [DATA_NEEDED: supported I/O standards]
Memory Blocks — [DATA_NEEDED: embedded memory block count]
Block RAM Capacity — [DATA_NEEDED: embedded block RAM capacity]
PLL Count — [DATA_NEEDED: PLL count]
RoHS Compliance — [DATA_NEEDED: RoHS compliance status]
REACH Compliance — [DATA_NEEDED: REACH compliance status]

Datenblätter & Ressourcen

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