EP3C16F484I7 vs EP3C25F324I7 Vergleich
Detaillierter Direktvergleich von EP3C16F484I7 von Intel und EP3C25F324I7 von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | EP3C16F484I7 | EP3C25F324I7 |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Aktiv | NRND |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $58,10 | $64,80 |
| Family | Cyclone III | — |
| Manufacturer | Intel (formerly Altera) | — |
| Logic Elements | 15,408 | — |
| Logic Array Blocks (LABs) | 963 | 1,539 |
| Total Embedded Memory | 516,096 bits (63 KB) | — |
| Embedded Memory Blocks | M9K x 56 | — |
| Embedded 18x18 Multipliers | 56 | 66 |
| User I/Os | 346 | — |
| General-Purpose PLLs | 4 | — |
| Gehäuse | 484-ball FineLine BGA (F484) | 324-ball FBGA (FineLine BGA), 19 x 19 mm, 1.0 mm pitch |
| Betriebstemperatur | -40C to +100C (industrial) | — |
| Speed Grade | 7 (fastest commercial/industrial) | — |
| Process Node | 60 nm TSMC low-power | — |
| Configuration Method | Passive Serial, Fast Passive Parallel, Active Serial, JTAG | — |
| RoHS-Status | Compliant | Compliant |
| Montageart | Surface Mount | Surface Mount |
| Series | — | Cyclone III |
| Logic Elements (LEs) | — | 24,624 |
| Embedded Memory | — | 608,256 bits (594 Kbits M9K blocks) |
| PLLs | — | 4 |
| Global Clock Networks | — | 20 |
| Maximum User I/O | — | 215 |
| Process Technology | — | TSMC 65 nm low-power CMOS |
| Core Voltage (VCCINT) | — | 1.2 V |
| I/O Voltage (VCCIO) | — | 1.2 V to 3.3 V (per bank) |
| Betriebs-Sperrschichttemperatur | — | -40 °C to +100 °C (industrial) |
| Configuration Modes | — | Passive Serial (PS), Active Serial (AS), JTAG |