EP3C16F484I7 vs EP3C25F324I7 Comparación
Comparación detallada lado a lado de EP3C16F484I7 por Intel y EP3C25F324I7 por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | EP3C16F484I7 | EP3C25F324I7 |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Activo | NRND |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $58,10 | $64,80 |
| Family | Cyclone III | — |
| Manufacturer | Intel (formerly Altera) | — |
| Logic Elements | 15,408 | — |
| Logic Array Blocks (LABs) | 963 | 1,539 |
| Total Embedded Memory | 516,096 bits (63 KB) | — |
| Embedded Memory Blocks | M9K x 56 | — |
| Embedded 18x18 Multipliers | 56 | 66 |
| User I/Os | 346 | — |
| General-Purpose PLLs | 4 | — |
| Encapsulado | 484-ball FineLine BGA (F484) | 324-ball FBGA (FineLine BGA), 19 x 19 mm, 1.0 mm pitch |
| Temperatura de funcionamiento | -40C to +100C (industrial) | — |
| Speed Grade | 7 (fastest commercial/industrial) | — |
| Process Node | 60 nm TSMC low-power | — |
| Configuration Method | Passive Serial, Fast Passive Parallel, Active Serial, JTAG | — |
| Estado RoHS | Compliant | Compliant |
| Tipo de montaje | Surface Mount | Surface Mount |
| Series | — | Cyclone III |
| Logic Elements (LEs) | — | 24,624 |
| Embedded Memory | — | 608,256 bits (594 Kbits M9K blocks) |
| PLLs | — | 4 |
| Global Clock Networks | — | 20 |
| Maximum User I/O | — | 215 |
| Process Technology | — | TSMC 65 nm low-power CMOS |
| Core Voltage (VCCINT) | — | 1.2 V |
| I/O Voltage (VCCIO) | — | 1.2 V to 3.3 V (per bank) |
| Temperatura de unión de funcionamiento | — | -40 °C to +100 °C (industrial) |
| Configuration Modes | — | Passive Serial (PS), Active Serial (AS), JTAG |