EP3C25F256I7N vs EP3C25F324C8 Vergleich
Detaillierter Direktvergleich von EP3C25F256I7N von Intel und EP3C25F324C8 von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | EP3C25F256I7N | EP3C25F324C8 |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Aktiv | NRND |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $27,20 | $23,10 |
| Device Type | FPGA | — |
| Family | Cyclone III | — |
| Logic Elements | 24,624 | 24,624 LE |
| Embedded Memory | 608,256 bits | 608,256 bits |
| Embedded Multipliers | 66 (18x18) | 66 (18 x 18) |
| Maximum User I/O | 156 | — |
| Core Supply Voltage | 1.2 V | — |
| Gehäuse | 256-FBGA (FineLine BGA) | 324-ball FBGA (FineLine BGA), 19 x 19 mm, 1.0 mm pitch |
| Betriebstemperatur | -40C to +125C | 0 °C to +85 °C (commercial) |
| Speed Grade | 7 | 8 (commercial) |
| Process Technology | 65 nm low-power | 65 nm CMOS, SRAM-based |
| PLLs | 4 general-purpose PLLs | 4 |
| External Memory Support | DDR/DDR2/QDRII/QDRII+ | — |
| Montageart | Surface Mount | Surface Mount (BGA) |
| RoHS-Status | Compliant (lead-free) | Non-compliant (per Lisleapex listing; original part number without 'N' suffix) |
| Hot Socketing | Supported | — |
| Configuration | SRAM-based, in-system programmable | — |
| Series | — | Cyclone III |
| Logic Array Blocks | — | 1,539 LABs |
| User I/Os | — | 215 |
| Core Voltage | — | 1.2 V |
| Maximum Internal Clock | — | 402 MHz |